2018
DOI: 10.1007/s00170-017-1529-x
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Ultra-precision diamond turning of optical silicon—a review

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Cited by 64 publications
(29 citation statements)
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References 226 publications
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“…( a ) Face milling setup with the cutting tool and force dynamometer, and micro-geometry of the ( b ) honed and ( c ) chamfered (T-land) cutting edge and ( d ) cutting edge forms with parametric edge dimensions (adapted from [36]).…”
Section: Figurementioning
confidence: 99%
“…( a ) Face milling setup with the cutting tool and force dynamometer, and micro-geometry of the ( b ) honed and ( c ) chamfered (T-land) cutting edge and ( d ) cutting edge forms with parametric edge dimensions (adapted from [36]).…”
Section: Figurementioning
confidence: 99%
“…In order to withstand the irradiation of high-power laser, it is necessary to avoid SSD as much as possible in the machining technologies for fused silica. Ultra-precision grinding, as an efficient and economical manufacturing technology for optical elements, is one of the important technologies for processing high-precision and high-quality fused silica [7][8][9][10][11][12]. But the surface and subsurface of fused silica after ultra-precision grinding usually contains SSD.…”
Section: Introductionmentioning
confidence: 99%
“…From discrepancy of the classical models, the commonly-produced lamellar chips in ultra-precision machining, 10–12 widely applied into many advanced manufacturing fields with sub-micrometric form accuracy and nanometric surface roughness 1316 indicate that the shear angle changes along with chip formation but not keep constant, i.e. cyclic shear angle.…”
Section: Introductionmentioning
confidence: 99%