2016
DOI: 10.1080/21681724.2016.1138506
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Ultra-low-power carbon nanotube FET-based quaternary logic gates

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Cited by 11 publications
(12 citation statements)
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“…The effectiveness of temperature variations on SRAM stability in terms of V DR process in the presence of other TT, SS, SF, FS, FF corner conditions using the proposed algorithm in Fig. 11 As the obtained results reveal, it can be concluded that V DR increases with temperature for TT, FF, slow-fast (SF) (0.4 Volt /0°C) and fast-slow (FS) (0.65 Volt / 80 °C) in all structures based on Si-MOSFET technology node, while decreases for the FS and SS corners, where due to the high thermal conductivity (stability) of carbon atoms in CNT-MOSFETs [38], the V DR metric for the suggested bit-cell and 6T CNT-MOSFET are less sensitive to the temperature variation process than other state-of-the art counterpart bit-cells. Finally, the distance of the worst result for VDR in the presence of temperature changes in the TT corner based on the algorithm and MC from the simulation for cell [32] in Fig.…”
Section: Evaluation Of Comprehensive Parameters For Vdr-based Bit Cellsmentioning
confidence: 75%
“…The effectiveness of temperature variations on SRAM stability in terms of V DR process in the presence of other TT, SS, SF, FS, FF corner conditions using the proposed algorithm in Fig. 11 As the obtained results reveal, it can be concluded that V DR increases with temperature for TT, FF, slow-fast (SF) (0.4 Volt /0°C) and fast-slow (FS) (0.65 Volt / 80 °C) in all structures based on Si-MOSFET technology node, while decreases for the FS and SS corners, where due to the high thermal conductivity (stability) of carbon atoms in CNT-MOSFETs [38], the V DR metric for the suggested bit-cell and 6T CNT-MOSFET are less sensitive to the temperature variation process than other state-of-the art counterpart bit-cells. Finally, the distance of the worst result for VDR in the presence of temperature changes in the TT corner based on the algorithm and MC from the simulation for cell [32] in Fig.…”
Section: Evaluation Of Comprehensive Parameters For Vdr-based Bit Cellsmentioning
confidence: 75%
“…In the above multiplier circuit, 53 CNTFET transistors were used to create the product and carry operators, and one power supply was used for the MUX units and control circuits. whereas the space applied decreased by 43.62% compared to [13] and by 61.59% compared to the first design [16]. The operators also decreased the power consumption by 98.46% compared to [13] and 98.26% compared to [16].…”
Section: Proposed Circuitsmentioning
confidence: 99%
“…whereas the space applied decreased by 43.62% compared to [13] and by 61.59% compared to the first design [16]. The operators also decreased the power consumption by 98.46% compared to [13] and 98.26% compared to [16].…”
Section: Proposed Circuitsmentioning
confidence: 99%
“…The primary difference between the CNTFETs and MOSFETs is in its carrier mobility and driving current strengths, which are the same only for CNTFETs of both P and N models but not for MOSFETs. The flexibility is afforded to CNTFETs of more compact designs where the scaling and sizing adjustments are carried out easily in highly complex circuits [17]. The more analogous behaviour in I-V characteristics of the CNTFET in contrast to MOSFET is a crucial enhancement in CNTFET.…”
Section: The Behavioural Model Of the Cntfetsmentioning
confidence: 99%
“…This causes nonmobility charge carriers due to the 1D ballistic transport. It is established as an emerging and reliable device in view its aforesaid properties substituting conventional silicon technology [17,22].…”
Section: Heavily Doped Cnt Segments For Source/drainmentioning
confidence: 99%