Ultra-low permittivity HSM/PTFE composites for high-frequency microwave circuit application

Li, Yuanyang; Zhou, Jing; Shen, Jie; Li, Qiangzhi; Qi, Yanyuan; Chen, Wen

doi:10.1007/s10854-022-07999-z

Cited by 15 publications

(15 citation statements)

References 33 publications

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“…It has turned out that the isolation material which is made of Polytetrafluoroethylene (PTFE) has a very strong impact especially in the low frequency domain. PTFE exhibits a small relative permittivity of about ε r = 2.1 [19]. Applying this relative permittivity value to the SMA connector model results in a characteristic impedance of 48.9 Ω [18].…”

Section: D Numerical Models Of Test Pcbsmentioning

confidence: 99%

“…The value of ε r = 1.55 might be explained due to additional composites within the PTFE material. As shown in [19], hollow silica microspheres (HSM) might be introduced as fillers in the PTFE material to reduce its relative permittivity. Nevertheless, as shown later in the result section, by modifying ε r of the SMA insulator material, one obtains excellent agreement between the simulation and the measurement results up to 26 GHz.…”

Section: D Numerical Models Of Test Pcbsmentioning

confidence: 99%

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Numerical Investigation of Signal Launch Imperfections for Edge Mount RF Connectors

et al. 2022

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In this paper, common practice RF design guidelines for SMA edge mount connectors are investigated in terms of numerical simulations and VNA measurements. These guidelines are used in a variety of applications for coaxial-to-planar interfaces but often do not provide information regarding the physical origins of increased insertion and transmission losses. The presented results in this work focus on different RF PCB design features and their impact on electromagnetic field distributions in the launching zone. The presented investigations should raise awareness on the issue of electromagnetic field resonances occurring in the RF frequency range and assist PCB design engineers to identify potential issues occurring at an coaxial-to-planar interface. The investigated PCB features facilitate a high performance RF PCB design up to a frequency of 26 GHz.

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Section: D Numerical Models Of Test Pcbsmentioning

confidence: 99%

Section: D Numerical Models Of Test Pcbsmentioning

confidence: 99%

Numerical Investigation of Signal Launch Imperfections for Edge Mount RF Connectors

et al. 2022

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“…Polymer/ceramic microwave dielectric composites show promise because they combine the benefits of ceramic and polymer materials, have great dielectric tunability, are easy to process, and are more suitable for industrial production [2] . Polytetrafluoroethylene (PTFE) has a significant advantage over other polymers in microwave dielectric materials due to its extremely low dielectric loss, stable dielectric constant, strong chemical stability, excellent thermal stability, and mechanical properties [3,4] . However, a major challenge in ceramic-filled composites is the incompatible interface between the organic polymer and the inorganic ceramic filler, where the considerable disparity in surface characteristics between the two causes not only uneven filler dispersion but also the formation of pores at the interface of the distinct phases, deteriorating the properties of the composites.…”

Section: Introductionmentioning

confidence: 99%

Investigation on the improvement of microwave dielectric properties of plasma-prepared fluoropolymer-coated CaTiO₃-filled PTFE composites

Zheng,

Wang,

et al. 2024

J. Phys.: Conf. Ser.

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High-performance polymer matrix composites preparation has been urgently hampered by poor interfacial adhesion between two phases. In this article, a thorough analysis of the microstructure and overall properties of composites made of polytetrafluoroethylene filled with fluorocarbon polymer film-coated CaTiO3 was conducted. The similar fluorocarbon molecular structure of CaTiO3 surface and PTFE provides a bridge between the two, significantly improving and promoting the microstructure and interface adhesion of the composite. The comprehensive properties of modified composites are obviously superior to those of untreated composites. Composites filled with 30 wt% CaTiO3 have an excellent dielectric constant at 5.53, acceptable dielectric loss at 0.0047, an outstanding heat resistance index of 281.1°C, and relatively low hygroscopicity of 0.10%. At the same time, the mechanical properties are maintained at a high application level, which makes them promising for microwave devices.

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“…Kurimoto et al 22 developed an epoxy/hollow silica nanocomposite and proved that the hollow structure of nanoparticles could endow polymer resins with low dielectric properties using the finite element method. Li et al 23 mechanically blended commercial hollow silica spheres with polytetrafluoroethylene, reducing the k value from the original 2.1 to 1.94. Wei et al 24 used the surface-initiated atom transfer radical polymerization (SI-ATRP) method to coat hollow silica microspheres with polystyrene to increase the compatibility between the microspheres and the polyethylene and reduce the dielectric constant of the material to 2.05.…”

Section: ■ Introductionmentioning

confidence: 99%

A Bis-Stabilized Interface Strategy for Low-k Benzocyclobutene-Based Hollow Silica Nanocomposites

Sun

Fan

et al. 2023

ACS Appl. Polym. Mater.

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A bis-stabilized interface strategy has been proposed to prepare high-performance low-dielectric (low-k) benzocyclobutene (BCB)-based nanocomposites by a rational-designed and facile-synthesized difunctional silane modifier. Hollow silica nanoparticles (HSNs) can be efficiently surface-modified with the difunctional silane to be evenly dispersed and chemically cross-linked with the BCB resin matrix during the post-thermal curing process, finally obtaining a series of HSNs-doped organic–inorganic nanocomposites. The dielectric properties of the resultant nanocomposites can be effectively adjusted by changing the doping ratios and cavity diameters of HSNs. Compared with commercial BCB resin, the dielectric constant of resultant 0.25 wt % HSNs-doped nanocomposites with a cavity diameter of 180 nm can be greatly reduced to 2.12 by 20%, maintaining the low level (10–4 at 1 kHz) of the dielectric loss, excellent thermal stability, and hydrophobicity as well. This study provides a facile and universal strategy to fabricate low-k BCB nanocomposites for future high-density advanced packaging applications.

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Ultra-low permittivity HSM/PTFE composites for high-frequency microwave circuit application

Cited by 15 publications

References 33 publications

Numerical Investigation of Signal Launch Imperfections for Edge Mount RF Connectors

Numerical Investigation of Signal Launch Imperfections for Edge Mount RF Connectors

Investigation on the improvement of microwave dielectric properties of plasma-prepared fluoropolymer-coated CaTiO₃-filled PTFE composites

A Bis-Stabilized Interface Strategy for Low-k Benzocyclobutene-Based Hollow Silica Nanocomposites

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Ultra-low permittivity HSM/PTFE composites for high-frequency microwave circuit application

Cited by 15 publications

References 33 publications

Numerical Investigation of Signal Launch Imperfections for Edge Mount RF Connectors

Numerical Investigation of Signal Launch Imperfections for Edge Mount RF Connectors

Investigation on the improvement of microwave dielectric properties of plasma-prepared fluoropolymer-coated CaTiO3-filled PTFE composites

A Bis-Stabilized Interface Strategy for Low-k Benzocyclobutene-Based Hollow Silica Nanocomposites

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Investigation on the improvement of microwave dielectric properties of plasma-prepared fluoropolymer-coated CaTiO₃-filled PTFE composites