2021
DOI: 10.1016/j.compositesa.2021.106387
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Ultra-low dielectric constant fluorinated graphene/polybenzoxazole composite films with excellent thermal stabilities and mechanical properties

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Cited by 24 publications
(34 citation statements)
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“…Among them, dielectric properties have reported the key factors that determine the application of a material in the field of electronic packaging. [ 34 ] In this context, FG‐Cs were synthesized by various methods, and their physicochemical and intrinsic activity and catalytic performance were evaluated toward a variety of applications. Zhang et al.…”
Section: Synthesis Methodsmentioning
confidence: 99%
See 4 more Smart Citations
“…Among them, dielectric properties have reported the key factors that determine the application of a material in the field of electronic packaging. [ 34 ] In this context, FG‐Cs were synthesized by various methods, and their physicochemical and intrinsic activity and catalytic performance were evaluated toward a variety of applications. Zhang et al.…”
Section: Synthesis Methodsmentioning
confidence: 99%
“…Among them, dielectric properties have reported the key factors that determine the application of a material in the field of electronic packaging. [34] In this context, FG-Cs were synthesized by various methods, and their physicochemical and intrinsic activity and catalytic performance were evaluated toward a variety of applications. Zhang et al first time reported the low dielectric constant (κ = 2.48) fluorinated graphene/polyimide (FG/PI) composite films via a facile solution blending process from polyamic acid (PAA) and FG solution.…”
Section: Fluorographene Compositementioning
confidence: 99%
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