Two-photon absorption for the realization of optical waveguides on printed circuit boards

Langer, Gregor; Riester, Markus

doi:10.1117/12.699382

Cited by 11 publications

(6 citation statements)

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“…In addition to the new way of creating the waveguide structures, a fundamental paradigm shift for the process sequence for the assembly process is proposed. The proof of concept has previously been shown in several arrangements [22], and this new implementation will allow the process to be used for creating optical components that can be used like electrical modules during assembly, while exhibiting the performance of optical modules or optical multi-chip modules (OMCM).…”

Section: New Manufacturing Process Flow For Optical Component Surfacementioning

confidence: 98%

“…Materials that suit most requirements have been under development and have been shown to work in the laboratory and demonstration arrangements [22]. These multifunctional materials have shown good performance in the particular arrangement.…”

Section: Materials Requirementsmentioning

confidence: 98%

“…After the waveguide polymerisation process using TPA structuring, the matrix material is polymerized, thus creating a protective layer on the chip, much like a dam & fill process including, however, the optical interconnect structures from the chip to the connector. The described process has been shown to work in PCB manufacturing [22], with subsequent processing of the optical layer in a lamination press at 200°C. Current materials available maintain a refractive index difference Δn of 0.005, which is large enough for SM waveguides to adequately guide light [16].…”

Section: New Manufacturing Process Flow For Optical Component Surfacementioning

confidence: 99%

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Chip-to-board interconnects for high-performance computing

Riester¹,

Houbertz-Krauss

Steenhusen

2013

SPIE Proceedings

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Super computing is reaching out to ExaFLOP processing speeds, creating fundamental challenges for the way that computing systems are designed and built. One governing topic is the reduction of power used for operating the system, and eliminating the excess heat generated from the system. Current thinking sees optical interconnects on most interconnect levels to be a feasible solution to many of the challenges, although there are still limitations to the technical solutions, in particular with regard to manufacturability. This paper explores drivers for enabling optical interconnect technologies to advance into the module and chip level. The introduction of optical links into High Performance Computing (HPC) could be an option to allow scaling the manufacturing technology to large volume manufacturing. This will drive the need for manufacturability of optical interconnects, giving rise to other challenges that add to the realization of this type of interconnection. This paper describes a solution that allows the creation of optical components on module level, integrating optical chips, laser diodes or PIN diodes as components much like the well known SMD components used for electrical components. The paper shows the main challenges and potential solutions to this challenge and proposes a fundamental paradigm shift in the manufacturing of 3-dimensional optical links for the level 1 interconnect (chip package)

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Section: New Manufacturing Process Flow For Optical Component Surfacementioning

confidence: 98%

Section: Materials Requirementsmentioning

confidence: 98%

Section: New Manufacturing Process Flow For Optical Component Surfacementioning

confidence: 99%

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Chip-to-board interconnects for high-performance computing

Riester¹,

Houbertz-Krauss

Steenhusen

2013

SPIE Proceedings

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“…3b). Beside the fabrication of 3D µ-optics, the two-photon 3D lithography is very well suited for the fabrication of waveguides in suitable materials, spanning from chalcogenide glasses [19] and fused silica [20] to organic materials or inorganic-organic hybrid materials such as ORMOCER ® s [21]. In order to take advantage of the 3D capabilities of this structuring method, a material, which can be used for both, waveguide core and waveguide coupling is ideal.…”

Section: Two-photon 3d Lithography (2p3dl) and Nano-imprint Lithograpmentioning

confidence: 99%

Rapid prototyping of micro-optics on organic light emitting diodes and organic photo cells by means of two-photon 3D lithography and nano-imprint lithography

et al. 2008

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Provided that suitable materials are available, novel structuring methods, such as two-photon-3D-lithography (2P3DL) and nano-imprint-lithography (NIL) are promising approaches for the fabrication of organic complex 2D and 3D structures. Optical materials based on photopolymerizable resins combined with novel efficient multi-photon photoinitiators can be used for a fast and simple fabrication of µ-optical components for MOEMS. The true 3D capabilities and the high spatial resolution of the 2P3DL permit the fabrication of nearly any optical designs from CAD. With supplementary feedback controlled positioning of the laser focus, a material can be processed at an explicit target position, e.g. on an organic LED or photo cell. The position of fabricated µ-optics relative to such devices is determined by 3D sample registration prior to the structuring process. Therefore, the alignment of laser written structures to existing sample features becomes a part of the fabrication process and no further assembly is required. We demonstrate the design and the fabrication of various µ-optical structures such as waveguides and µ-lenses for photonic µ-systems by means of 2P3DL. Furthermore, µ-lens masters prototyped by means of two-photon-3D-lithography and their replication via a PDMS stamp by means of NIL are presented. In addition, it can be shown that such µ-optical systems can be fabricated in situ on organic LEDs or organic photo cells enabling powerful building blocks for µ-optical systems.

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“…Dependent on the TPA processing parameters, refractive indices of about 0.002 before and of about 0.0015 after thermal curing at 200 °C for 2 h were achieved. Even with this low index difference, data transport of 1 to 3 Gbit/s could be demonstrated at bit error rates (BER) as low as 10 -12 , whereas an exchange of the emitter and introducing an electrical low-pass filter into the characterization equipment has yielded data transfer rates as high as 5 Gbit/s, but with a higher BER of about 10 -9 [23,26,27]. It should be mentioned, however, that much higher values could be achieved with other material/initiator modifications which will be published elsewhere.…”

Section: Figurementioning

confidence: 99%

Optical Waveguides Embedded in PCBs - A Real World Application of 3D Structures Written by TPA

et al. 2007

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The integration of optical interconnects in printed circuit boards (PCB) is a rapidly growing field worldwide due to a continuously increasing need for high-speed data transfer. There are any concepts discussed, among which are the integration of optical fibers or the generation of waveguides by UV lithography, embossing, or direct laser writing. The devices presented so far require many different materials and process steps, but particularly also highly-sophisticated assembly steps in order to couple the optoelectronic elements to the generated waveguides. In order to overcome these restrictions, an innovative approach is presented which allows the embedding of optoelectronic components and the generation of optical waveguides in only one optical material. This material is an inorganic-organic hybrid polymer, in which the waveguides are processed by two-photon absorption (TPA) processes, initiated by ultra-short laser pulses. In particular, due to this integration and the possibility ofin situpositioning the optical waveguides with respect to the optoelectronic components by the TPA process, no complex packaging or assembly is necessary. Thus, the number of necessary processing steps is significantly reduced, which also contributes to the saving of resources such as energy or solvents. The material properties and the underlying processes will be discussed with respect to optical data transfer in PCBs.

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Two-photon absorption for the realization of optical waveguides on printed circuit boards

Cited by 11 publications

References 0 publications

Chip-to-board interconnects for high-performance computing

Chip-to-board interconnects for high-performance computing

Rapid prototyping of micro-optics on organic light emitting diodes and organic photo cells by means of two-photon 3D lithography and nano-imprint lithography

Optical Waveguides Embedded in PCBs - A Real World Application of 3D Structures Written by TPA

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