Two-objective metaheuristic optimization for floating gate transistor-based CMOS-MEMS inertial sensors

Granados-Rojas, Benito; Reyes-Barranca, M. A.; Gonzalez-Navarro, Yesenia Eleonor; Abarca-Jimenez, Griselda Stephany; Aleman, M.; Mendoza-Acevedo, S.; Flores-Nava, L.M.

doi:10.1007/s00542-020-05194-w

Cited by 2 publications

(1 citation statement)

References 12 publications

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“…El Hami, 2012;N. El Hami et al, 2010;Reddad et al, 2022;Rhouas & El Hami, 2022;Zemzami et al, 2017Zemzami et al, , 2020, in diverse fields such as engineering design (Chien et al, 2021;Granados-Rojas et al, 2021;N. El Hami et al, 2015a, 2015bKumar et al, 2020;Ranjan et al, 2022), logistics, supply chain management, finance (N. El Hami & Bouchekourte, 2016), manufacturing and production planning, telecommunications (Ammari et al, 2014;Ghallali et al, 2013), healthcare (Alrajeh et al, 2012, environmental control and protection (Bhanja et al, 2022), energy systems (Lailianfeng & ChangTing-cheng, 2021;Obiora et al, 2021), transportation and logistics, machine learning and data mining, healthcare and water resource management.…”

Section: Introductionmentioning

confidence: 99%

Hybrid model of the FEM method and the SAR algorithm to perform reliability-based design optimization of the solder joints in the BGA assembly

Reddad,

Zemzami,

Hami

et al. 2024

Preprint

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Metaheuristic optimization algorithms are powerful for solving complex optimization problems, almost when we lack information about the nature of their objective function. Meanwhile, the Finite Element Method (FEM) is a very powerful method for predicting and simulating the behavior of systems subjected to various stresses, whether electrical, thermal, mechanical, vibratory or magnetic. In the current study, we have proposed an optimization methodology that couples a metaheuristic algorithm - the Search and Rescue Algorithm (SAR) - with the finite element method. We then investigated the proposed methodology for optimizing the reliability of solder balls with respect to their geometry in a Ball Grid Array (BGA) assembly subjected to thermal cycling load. First, we performed a sensitivity analysis to determine the parameters influencing solder ball reliability, then we optimized the plastic deformation of solder balls, hence increasing their reliability as a function of their geometry through the proposed methodology, which results in improving the reliability of the entire electronic component.

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