Two-/Multi-Photon Imaging for Characterization of Fine Line Features and Microvias in Advanced Packaging

Kathaperumal, Mohan; Nie, Bai; Bhaskar, Pragna; Blancher, Christopher; Nimbalkar, Pratik; Liu, Fuhan; Swaminathan, Madhavan

doi:10.1109/ectc51906.2022.00264

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022

DOI: 10.1109/ectc51906.2022.00264

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Two-/Multi-Photon Imaging for Characterization of Fine Line Features and Microvias in Advanced Packaging

Mohan Kathaperumal

Bai Nie

Pragna Bhaskar

et al.

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Two-/Multi-Photon Imaging for Characterization of Fine Line Features and Microvias in Advanced Packaging

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