2023
DOI: 10.1039/d3nr00637a
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Two-dimensional MoSi2As4-based field-effect transistors integrating switching and gas-sensing functions

Abstract: Multifunctional nanoscale devices integrating the multiple functions are of great importance in meeting the requirement of next-generation electronics. Herein, using first-principles calculations, we propose multifunctional devices based on the two-dimensional...

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Cited by 10 publications
(9 citation statements)
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“…It is also found that the SS of n-type WSi 2 N 4 MOSFETs with L UL = 2 nm and L g = 5 nm is 71 mV/dec. However, the p-type WSi 2 N 4 MOSFET with L UL = 2 nm and L g = 5 nm exhibits an SS of 60 mV/dec, which is higher than that in the reported WGe 2 N 4, 25 MoSi 2 As 4 transistors, 34 and exactly reaches the limit of the ideal thermionic transistors. 43 Intrinsic Delay Time and Power Dissipation.…”
Section: ■ Results and Discussionmentioning
confidence: 60%
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“…It is also found that the SS of n-type WSi 2 N 4 MOSFETs with L UL = 2 nm and L g = 5 nm is 71 mV/dec. However, the p-type WSi 2 N 4 MOSFET with L UL = 2 nm and L g = 5 nm exhibits an SS of 60 mV/dec, which is higher than that in the reported WGe 2 N 4, 25 MoSi 2 As 4 transistors, 34 and exactly reaches the limit of the ideal thermionic transistors. 43 Intrinsic Delay Time and Power Dissipation.…”
Section: ■ Results and Discussionmentioning
confidence: 60%
“…However, I on of p-type WSi 2 N 4 MOSFETs with L g = 5 nm and L UL = 2 nm can reach 1546 μA/μm, which is higher than that reported in p-type MoSi 2 N 4 , WGe 2 N 4 , MoSi 2 As 4 MOSFETs, and far exceeds the ITRS HP targets. 24,25,34 Moreover, I on of n-type MOSFETs with L UL = 1 nm and L g = 5 nm can reach 687 μA/μm, which meets 76% of the ITRS HP goal. For LP applications, I on of all p-and n-type MOSFETs fails to meet the ITRS LP goal (295 μA/μm).…”
Section: ■ Results and Discussionmentioning
confidence: 83%
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“…The dielectric equivalent oxide thickness is 0.41 nm and the dielectric constant is 3.9 ε 0 . To obtain excellent device performance in practice, one can adopt the 2D h -BN as the dielectric material, which has been proven as an excellent alternative dielectric material of SiO 2 . When the bias ( V b or V ds ) ( V b = V ds = V d – V s ) and gate voltage ( V g ) were applied to the device, the current can be calculated by the Landauer-Búttiker formula: I ( V ds , V normalg ) = 2 e h normal∞ + normal∞ { T false( E , V ds , V g false) false[ f s ( E μ normals ) f d ( E μ normald ) false] } normald E where T ( E , V ds , V g ) is the transmission coefficient, μ is the chemical potential of the electrode.…”
Section: Computational Detailsmentioning
confidence: 99%
“…27 It has been demonstrated that such materials are superior to TMDs and may be comparable to graphene in various fields including optoelectronics, energy conversion, and nanoelectronics. 28–30 Among the new MA 2 Z 4 materials, WGe 2 N 4 is a non-magnetic semiconductor material with a bandgap of 1.20 eV, high hole mobility (2490 cm 2 V −1 s −1 ), and outstanding environmental stability, and WGe 2 N 4 based electronic devices exhibit excellent performance. 28,31 Therefore, it is worth expecting that introducing magnetism through adsorption of transition metal atoms makes it a promising material for spintronic applications.…”
Section: Introductionmentioning
confidence: 99%