1998
DOI: 10.1109/58.660144
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Two-dimensional arrays for medical ultrasound using multilayer flexible circuit interconnection

Abstract: The development of 2-D array transducers has received much recent interest. Unfortunately, fabrication of high density 2-D arrays is difficult due to the large number of electrical interconnections which must be made to the back side of the elements. A typical array operating at 2.2 MHz may have 256 or more connections within a 16.4 mm circular footprint. Interconnection becomes even more challenging as operating frequencies increase. To solve this problem, we have developed a multilayer flexible (MLF) circuit… Show more

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Cited by 56 publications
(29 citation statements)
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“…Detecting high-frequency ultrasound signals (e.g., ~hundreds of MHz) usually requires carefully manufactured transducers with thin and fragile piezoelectric elements. Besides, due to the resonance effect in the piezoelectric part, these transducers usually have maximum responses at a high frequency, and therefore, a reduced response at the low frequency regime [18][19][20].…”
Section: Introductionmentioning
confidence: 99%
“…Detecting high-frequency ultrasound signals (e.g., ~hundreds of MHz) usually requires carefully manufactured transducers with thin and fragile piezoelectric elements. Besides, due to the resonance effect in the piezoelectric part, these transducers usually have maximum responses at a high frequency, and therefore, a reduced response at the low frequency regime [18][19][20].…”
Section: Introductionmentioning
confidence: 99%
“…14, the proposed transducer assembly is shown with the IC transmitters and Preamplifiers. The single and multi-layer hybrid ceramic is bonded to a polyimide flexible circuit connector [17]. This is used in place of conventional wire guides [14], and it is similar in design and concept to the thick film, multi-layer alumina connectors previously designed and tested at Duke [18].…”
Section: Proposed Implementationmentioning
confidence: 99%
“…Second, the design of high density 2D array transducers involves interconnecting a large number of elements to the back side of the array. These electrical interconnections still remain the major difficulty in spite of progress made in the circuit interconnection techniques and in the choice of various material parameters [30]- [34]. The close proximity of the elements induces electrical cross-coupling that reduces the gain for large steering angles, and the spacing between the elements must be precise in order to limit the occurrence of unwanted grating lobes in the array response.…”
Section: Introductionmentioning
confidence: 98%