Articles you may be interested inThe effects of the in-plane momentum on the quantization of nanometer metal-oxide-semiconductor devices due to the difference between the effective masses of silicon and gate oxide Appl. Phys. Lett. 91, 123519 (2007); 10.1063/1.2789733 Polysilicon metal-insulator-semiconductor electron emitter Determination of electron trap distribution in the gate-oxide region of the deep submicron metal-oxide-semiconductor structure from direct tunneling gate current Effective lifetime of electrons trapped in the oxide of a metal-oxide-semiconductor structure Appl. Phys. Lett. 75, 522 (1999); 10.1063/1.124435Hot electron impact excitation cross-section of Er 3+ and electroluminescence from erbium-implanted silicon metal-oxide-semiconductor tunnel diodes Ultralarge metal-oxide-semiconductor ͑MOS͒ devices with an active oxide area of 1 cm 2 have been fabricated for use as electron emitters. The MOS structures consist of a Si substrate, a SiO 2 tunnel barrier ͑ϳ5 nm͒, a Ti wetting layer ͑3-10 Å͒, and a Au top layer ͑5-60 nm͒. Electron emission from the Au metal layer to vacuum is realized from these devices by applying bias voltages larger than the work function of the Au layer. The emission is characterized for Au layers with thicknesses ranging from 5 to 60 nm nominally. The emission efficiency changes from close to 10 −6 to 10 −10 . The Ti wetting layer is varied from 3 to 10 Å which changes the emission efficiency by more than one order of magnitude. The apparent mean free path of ϳ5 eV electrons in Au is found to be 52 Å. Deposition of Cs on the Au film increased the electron emission efficiency to 4.3% at 4 V by lowering the work function. Electron emission under high pressures ͑up to 2 bars͒ of Ar was observed.