“…9 As among the two-terminal memristor devices, resistive random access memory devices (RRAM), including conductive bridge random access memory (CBRAM) using a metallic filament, valence change memory (VCM) with an oxygen-vacancy filament, and interfacial-type RRAM with oxygen redistribution particularly at the interface, have been reported to have low energy consumption down to sub-pJ per synaptic event and good scalability for high-density integration, forming a crossbar array structure with CMOS compatibility. [10][11][12] To date, RRAM devices with a variety of oxides have been researched for synaptic device application, such as HfO 2 , [13][14][15] Ta 2 O 3 , [16][17][18] WO x , [19][20][21] TiO 2 , [22][23][24] CeO 2 , 7,25,26 ZnO, [27][28][29] NiO, [30][31][32] SrFeO x , 33 and PCMO. 34,35 With respect to the resistance change mechanism, filamentary-type CBRAM and VCM suffer from a non-linear, digital-type and asymmetric resistance change with a large device-to-device variation due to the abrupt and stochastic nature of filament formation.…”