The physicochemical
properties of titanium dioxide (TiO2) depend strongly on
the crystal structure. Compared to anatase,
rutile TiO2 has a smaller bandgap, a higher dielectric
constant, and a higher refractive index, which are desired properties
for TiO2 thin films in many photonic applications. Unfortunately,
the fabrication of rutile thin films usually requires temperatures
that are too high (>400 °C, often even 600–800 °C)
for applications involving, e.g., temperature-sensitive substrate
materials. Here, we demonstrate atomic layer deposition (ALD)-based
fabrication of anatase and rutile TiO2 thin films mediated
by precursor traces and oxide defects, which are controlled by the
ALD growth temperature when using tetrakis(dimethylamido)titanium(IV)
(TDMAT) and water as precursors. Nitrogen traces within amorphous
titania grown at 100 °C inhibit the crystal nucleation until
375 °C and stabilize the anatase phase. In contrast, a higher
growth temperature (200 °C) leads to a low nitrogen concentration,
a high degree of oxide defects, and high mass density facilitating
direct amorphous to rutile crystal nucleation at an exceptionally
low post deposition annealing (PDA) temperature of 250 °C. The
mixed-phase (rutile–brookite) TiO2 thin film with
rutile as the primary phase forms upon the PDA at 250–500 °C
that allows utilization in broad range of TiO2 thin film
applications.