TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking

Na, Duk Ju; Aung, Kyaw Myo; Choi, Won Kyung; Kida, Takuro; Ochiai, Toshihiko; Hashimoto, Takashi; Kimura, Michitaka; Kata, Keiichirou; Yoon, Seung Wook; Yong, Andy

doi:10.1109/ectc.2014.6897346

Cited by 7 publications

(2 citation statements)

References 10 publications

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“…Moore's law predicts that the scale of integrated circuits in chips will become larger and more prominent in the future, but reducing the size of transistors to improve performance is quite challenging. Accordingly, three-dimensional (3D) integration in integrated circuit technology has emerged as a promising new direction [1,2]. Wafer bonding technology is an essential technology for achieving precise 3D integration.…”

Section: Introductionmentioning

confidence: 99%

High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating

Fan

Zou

et al. 2022

Micromachines

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This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase calculation on the moiré fringe images corresponding to the upper and lower wafers, the relative offset of the upper and lower wafers can be accurately calculated. These moiré fringes are exceptionally stable, thereby enhancing the alignment stability. In this study, through practical experiments, we tested the rationality and practicability of the mark.

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Section: Introductionmentioning

confidence: 99%

High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating

Fan

Zou

et al. 2022

Micromachines

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“…Although various criterions may lead to wide variation in results, packaging reliability tests with different criterions were found from the literatures and the industrial standards. For example, the failure criterions for direct current electrical reliability measurement used in a single conference included relative resistance change at 5% [1], 10% [2][3][4][5][6], 15% [7,8], 20% [3,[9][10][11], or a resistance threshold [12]. After reviewing typical TSV reliability paper, it was interesting to note that a large variety of criterions were used in the literatures [13][14][15][16][17][18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

Lwo

Tseng

Tseng³

2016

Journal of Electronic Packaging

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Three-dimensional (3D) structure with through silicon via (TSV) technology is emerging as a key issue in microelectronic packaging industry, and electrical reliability has become one of the main technical subjects for the TSV designs. However, criteria used for TSV reliability tests have not been consistent in the literature, so that the criterion itself becomes a technical argument. To this end, this paper first performed several different reliability tests on the testing packaging with TSV chains, then statistically analyzed the experimental data with different failure criteria on resistance increasing, and finally constructed the Weibull failure curves with parameter extractions. After comparing the results, it is suggested that using different criteria may lead to the same failure mode on Weibull analyses, and 65% of failed devices are recommended as a suitable termination for reliability tests.

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High throughput thermocompression bonding enabled with a flexible manufacturing platform

Strothmann

Clauberg

2016

2016 China Semiconductor Technology International Conference (CSTIC)

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TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking

Cited by 7 publications

References 10 publications

High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating

High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

High throughput thermocompression bonding enabled with a flexible manufacturing platform

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