Abstract:In this paper, we utilize deep convolutional neural networks (CNNs) to classify the morphology of through-silicon via (TSV) extrusion in three dimensional (3D) integrated circuits (ICs). TSV extrusion is a crucial reliability concern which can deform and crack interconnect layers in 3D ICs and cause device failures. Herein, the white light interferometry (WLI) technique is used to obtain the surface profile of the extruded TSVs. We have developed a program that uses raw data obtained from WLI to create a TSV e… Show more
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