2022 IEEE International Test Conference India (ITC India) 2022
DOI: 10.1109/itcindia202255192.2022.9854518
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TSV BIST Repair: Design-For-Test Challenges and Emerging Solution for 3D Stacked IC's

Akkapolu Sankararao1,
Vaishnavi G2,
Sandya Rani Malige3
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