Tristable Memory Devices Based on Soluble Polyimides Containing Pendant Carbazole and Phenyl Groups

Abstract

As an important component of highly functional macromolecule semiconductor, two kinds of new diamine monomers, bis(5‐amino‐6‐methoxy‐[1,1’‐biphenyl]‐3‐yl) methanone (BAMBPM) and bis(5‐amino‐4’‐(9H‐carbazol‐9‐yl)‐6‐methoxy‐[1,1’‐biphenyl]‐3‐yl) methanone (BACzMBPM) were used as raw materials. Two kinds of soluble aromatic polyimides were prepared from BAMBPM and BACzMBPM by polycondensation with 2,2’,3,3’‐biphenyl tetracarboxylic dianhydride (BPDA) via a two‐step procedure. The obtained polyimides were sufficiently characterized, and showed superior organic solubility and excellent thermal stability, with a weight loss of 5 % weight loss above 300 °C. Memory devices with Al/polyimide/ITO structure were prepared by the traditional method of solution spin coating. Both devices show tristable characteristics, with high ON/OFF current ratios as high as 104 and long maintenance times of 104 seconds in the environmental atmosphere.

Multifunctional Polyimides for Resistive Switching Memory Devices Based on Flexible Transparent Polyimide--AgNWs Hybrid Electrodes

“…More importantly, PIs with the special donor-acceptor (D-A) type molecular structures exhibiting stronger intramolecular and intermolecular charge transfer (CT) effects are more promising for the flexible memory devices. [26][27][28][29] Up to now, a large number of PIs exhibit various kinds of memory properties, including the volatile memory properties (Dynamic Random-Access Memory [31] (DRAM), Static Random Access Memory [32] (SRAM)) and the non-volatile memory properties (FLASH [33] , Write Once Read Many [34] (WORM)). However, most reported PI based memory devices are rigid and non-wearable, which limits their application in flexible electronics.…”

Multifunctional polyimides for resistive switching memory devices based on flexible transparent polyimide–silver nanowires hybrid electrodes

“…In recent years, functional polyimides (PIs) were regarded as the most promising polymeric electronic memory materials due to their excellent thermal resistance, 22 chemical stability, 23 mechanical durability, 24 and flexibility 25 . More importantly, PIs with the special donor‐acceptor (D‐A) type molecular structures exhibiting stronger intramolecular and intermolecular charge transfer (CT) effects are more promising for the flexible memory devices 26–29 . Up to now, a large number of PIs exhibit various kinds of memory properties, including the volatile memory properties (dynamic random access memory 30 (DRAM), static random access memory 31 (SRAM)) and the non‐volatile memory properties (FLASH, 32 write once read many 33 (WORM)).…”

“…25 More importantly, PIs with the special donor-acceptor (D-A) type molecular structures exhibiting stronger intramolecular and intermolecular charge transfer (CT) effects are more promising for the flexible memory devices. [26][27][28][29] Up to now, a large number of PIs exhibit various kinds of memory properties, including the volatile memory properties (dynamic random access memory 30 (DRAM), static random access memory 31 (SRAM)) and the non-volatile memory properties (FLASH, 32 write once read many 33 (WORM)). However, most reported PI-based memory devices are rigid and non-wearable, which limit their potential applications in flexible electronics.…”