Tribological Behavior of Cotton Fabric/Phenolic Resin Laminated Composites Reinforced with Two-Dimensional Materials
Yonggang Guo,
Chenyang Fang,
Tingmei Wang
et al.
Abstract:In this study, cotton fabric-reinforced phenolic resin (CPF) composites were modified by adding four two-dimensional fillers: graphitic carbon nitride (g-C3N4), graphite (Gr), molybdenum disulfide (MoS2), and hexagonal boron nitride (h-BN). The tribological properties of these modified materials were investigated under dry friction and water lubrication conditions. The CPF/Gr composite exhibits significantly better tribological performance than the other three filler-modified CPF composites under dry friction,… Show more
“…Liu et al [ 15 ] found that MoS 2 can effectively reduce the deformation of the PI wear surface, thus reducing and stabilizing friction. Guo et al [ 16 ] doped phenolic resin (CPF) composites with 10 wt.% MoS 2 , which resulted in a 56% decrease in wear rate compared to pure CPF. The above studies show that MoS 2 -modified polymer composites have great strength and toughness, a low coefficient of friction, and high wear resistance.…”
Polyimide (PI) has been widely used in cable insulation, thermal insulation, wind power protection, and other fields due to its high chemical stability and excellent electrical insulation and mechanical properties. In this research, a modified PI composite film (MoS2@PDA/PI) was obtained by using polydopamine (PDA)-coated molybdenum disulfide (MoS2) as a filler. The low interlayer friction characteristics and high elastic modulus of MoS2 provide a theoretical basis for enhancing the flexible mechanical properties of the PI matrix. The formation of a cross-linking structure between a large number of active sites on the surface of the PDA and the PI molecular chain can effectively enhance the breakdown field strength of the film. Consequently, the tensile strength of the final sample MoS2@PDA/PI film increased by 44.7% in comparison with pure PI film, and the breakdown voltage strength reached 1.23 times that of the original film. It can be seen that the strategy of utilizing two-dimensional (2D) MoS2@PDA nanosheets filled with PI provides a new modification idea to enhance the mechanical and electrical insulation properties of PI films.
“…Liu et al [ 15 ] found that MoS 2 can effectively reduce the deformation of the PI wear surface, thus reducing and stabilizing friction. Guo et al [ 16 ] doped phenolic resin (CPF) composites with 10 wt.% MoS 2 , which resulted in a 56% decrease in wear rate compared to pure CPF. The above studies show that MoS 2 -modified polymer composites have great strength and toughness, a low coefficient of friction, and high wear resistance.…”
Polyimide (PI) has been widely used in cable insulation, thermal insulation, wind power protection, and other fields due to its high chemical stability and excellent electrical insulation and mechanical properties. In this research, a modified PI composite film (MoS2@PDA/PI) was obtained by using polydopamine (PDA)-coated molybdenum disulfide (MoS2) as a filler. The low interlayer friction characteristics and high elastic modulus of MoS2 provide a theoretical basis for enhancing the flexible mechanical properties of the PI matrix. The formation of a cross-linking structure between a large number of active sites on the surface of the PDA and the PI molecular chain can effectively enhance the breakdown field strength of the film. Consequently, the tensile strength of the final sample MoS2@PDA/PI film increased by 44.7% in comparison with pure PI film, and the breakdown voltage strength reached 1.23 times that of the original film. It can be seen that the strategy of utilizing two-dimensional (2D) MoS2@PDA nanosheets filled with PI provides a new modification idea to enhance the mechanical and electrical insulation properties of PI films.
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