2022
DOI: 10.1021/acsami.2c14837
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Transportable, Endurable, and Recoverable Liquid Metal Powders with Mechanical Sintering Conductivity for Flexible Electronics and Electromagnetic Interference Shielding

Abstract: Liquid metals (LMs, e.g., EGaIn) promise a vast potential in accelerating the development of flexible electronics, smart robots, and wearable and biomedical devices. Although a variety of emerging processing methods are reported, they suffer several risks (e.g., leakage, weak adhesion, and low colloidal and chemical stability) because of their excellent fluidity, high surface tension, and rapid oxidation. Herein, liquid metal powders (LMPs) are fabricated based on a versatile method by vigorously stirring EGaI… Show more

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Cited by 14 publications
(16 citation statements)
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“…Liquid metals (e.g., EGaIn, Ga/In at 75 : 25 wt/wt) with good fluidity and high electrical and thermal conductivity, have been utilized in flexible electronics and sensors and as electromagnetic interference-shielding materials. [22][23][24][25][26] However, leakage resulting from their good fluidity can lead to serious risks of short-circuiting and corrosion, 22 which pose great challenges during handling and processing. Besides, the ultrahigh surface tension of liquid metals (i.e., 624 mN m À1 for EGaIn) makes it difficult to achieve a stable interface of the liquid metal with other materials (e.g., composite matrix, patterning substrates).…”
Section: Introductionmentioning
confidence: 99%
“…Liquid metals (e.g., EGaIn, Ga/In at 75 : 25 wt/wt) with good fluidity and high electrical and thermal conductivity, have been utilized in flexible electronics and sensors and as electromagnetic interference-shielding materials. [22][23][24][25][26] However, leakage resulting from their good fluidity can lead to serious risks of short-circuiting and corrosion, 22 which pose great challenges during handling and processing. Besides, the ultrahigh surface tension of liquid metals (i.e., 624 mN m À1 for EGaIn) makes it difficult to achieve a stable interface of the liquid metal with other materials (e.g., composite matrix, patterning substrates).…”
Section: Introductionmentioning
confidence: 99%
“…5 Flexible fibers that can undergo bending, twisting, and stretching with good durability as well as have high conductivity and comfort are indispensable for constructing flexible wearable electronics. 6 Typically, conductive fibers are present in conductive components for electric conduction, such as silver, 7 copper, 8 graphene, carbon nanotubes (CNTs), 9,10 MXene, 11 liquid metals, 12,13 polypyrrole (PPy) 9 and polyacrylonitrile (PAN). 5 These conductive materials could be composited into fibers by co-mingled spinning (e.g., electrospinning and wet spinning), 14,15 dip-coating, 16,17 chemical plating, 18 vapor deposition, 19 and in situ polymerization.…”
Section: Introductionmentioning
confidence: 99%
“…Typically, conductive fibers are present in conductive components for electric conduction, such as silver, copper, graphene, carbon nanotubes (CNTs), , MXene, liquid metals, , polypyrrole (PPy) and polyacrylonitrile (PAN) . These conductive materials could be composited into fibers by co-mingled spinning (e.g., electrospinning and wet spinning), , dip-coating, , chemical plating, vapor deposition, and in situ polymerization .…”
Section: Introductionmentioning
confidence: 99%
“…Initially, eutectic gallium-indium and Galinstan were coated onto substrates such as dense polymer films or textiles to create stretchable and flexible conductive traces. [12] Second, micro-and nanosized RT-GaLMs can be used as a conductive functional ink to print circuit patterns on soft substrates such as elastomers and polymers, as well as functional fillers in the polymer matrix, allowing the development of flexible and reconfigurable electronic circuits. [13,14] Third, RT-GaLMs can be integrated in polymer matrix used as a sensing element in pressure, strain, gas, and moisture sensors due to their high electrical conductivity and functionality.…”
Section: Introductionmentioning
confidence: 99%