Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams

Martin-Gallego, Mario; Lopez-Hernandez, Emil; Pinto, Javier; Rodríguez‐Pérez, Miguel Ángel; López–Manchado, Miguel A.; Verdejo, Raquel

doi:10.3390/polym11050756

Cited by 7 publications

(11 citation statements)

References 42 publications

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“…When the temperature drops below the temperature threshold, the capsule releases the stored thermal energy again. Expancel microspheres, on the other hand, are particles which, due to their structure, are characterized by poor thermal conductivity [ 29 ] (unlike tungsten), which allows the evaluation of this feature on the rate of heat removal from the tested material. Montmorillonite is a material from the group of nano-additives used in ablative composites, i.e., materials that form barriers against the effects of heat flux.…”

Section: Methodsmentioning

confidence: 99%

Temperature Rise of an Adhesive Particle-Reinforced Polymer during Fatigue Testing

et al. 2023

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Construction adhesives are usually polymers that have been modified to achieve specific properties so that they can be used under various loading conditions. An attempt was made to estimate the effect of fatigue loading on the temperature of an adhesive material by further physically modifying the basic adhesive composition used in the research. The temperature of the materials during the tests was recorded using a thermal imaging camera and a thermoelectric thermometer. For most materials tested at 20 Hz, an increase in the number of load cycles corresponded to an increase in the temperature of the samples. For a frequency of 30 Hz, after the temperature increased by a certain value, the temperature of the modified samples recorded with the thermal imaging camera decreased. Fatigue loading caused an increase of the temperature of all tested polymeric materials. Observation of the sample during testing with a thermal imaging camera allows a simple identification of the areas with the highest temperature and can be much more useful in practice than recording temperatures with a thermocouple thermometer, as thermocouples need to be properly positioned before testing.

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Section: Methodsmentioning

confidence: 99%

Temperature Rise of an Adhesive Particle-Reinforced Polymer during Fatigue Testing

et al. 2023

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“…For the preparation of SMEF samples, expandable polymer microsphere MSH‐550 was added homogeneously into epoxy DGEBA at ≈90 °C, then mixed with the melted curing agents, stirred for ≈10 min, finally poured into a preheated mold (120 × 120 × 20 mm) for foaming, and curing like the preparation of SMEP samples, rather than curing first at the expanding temperature of microsphere. [ 42,44 ] To improve the density of SMEF samples, fine barite powder (8‐10% in weight) was mixed with DGEBA at first with the aids of coupling agent KH550 (3‐aminopropyltriethoxysilane, APTES).…”

Section: Methodsmentioning

confidence: 99%

High Performance Shape Memory Epoxy Syntactic Foam Composites as Lost Circulation Material in Deep Drilling

Ma,

Ren,

Wang

et al. 2023

Macro Materials & Eng

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Lost circulation is a critical issue in drilling. This work reports the investigations on shape memory epoxy polymers (SMEPs) with high switching temperatures, and good thermal, mechanical and shape memory properties for plugging in deep drilling. The SMEPs are produced by curing diglycidyl ether of bisphenol A (DGEBA) and castor oil glycidyl ether (COGE) with a flexible poly(oxypropylene) diamine (D230) and a rigid 4, 4′ ‐diaminodiphenyl methane (DDM). Increasing D230 contents or using COGE, glass transition temperature (Tg, 93–163 °C, DMA analyses) and crosslink density of SMEPs are reduced, shape recovery rate is increased, while tensile strength, elongation at break and impact strength are improved. Further, shape memory epoxy syntactic foams (SMEFs) with high‐temperature adhesion are developed by introducing polymer microspheres into SMEPs. The SMEFs have compression ratio of 52–58%, and expansion ratio of 100% by adding 2% wt. microspheres. They retain the Tg and thermal stability of SMEPs, and show a delayed, slower recovery than SMEPs. Long fracture plugging experiments exhibit that a pressure‐bearing capability of 8.99–9.81 MPa is achieved with SMEFs in sealing fracture slots at a high temperature.

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“…Fillers in composite foams include hollow glass microspheres, polymer microspheres, carbon spheres, and large-scale glass spheres. [13][14][15][16] Due to their closed-cell structures, composite foams are lightweight, high-strength, waterproof, and have good corrosion resistance and low thermal conductivities. As a result, composite foams have been applied in aerospace and marine engineering fields.…”

Section: Introductionmentioning

confidence: 99%

Dynamic mechanical behaviors of epoxy resin/hollow polymeric microsphere composite foams under forced non-resonance and forced resonance

Fan

Ouyang

et al. 2021

Composites and Advanced Materials

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Composite foams with 10–50 vol% hollow polymeric microspheres were prepared using bisphenol A epoxy resin and polyetheramine curing agent as the matrix. The results demonstrated that the density, hardness, and static mechanical properties of the epoxy resin/hollow polymer microsphere composite foams, as well as their dynamic mechanical properties under forced non-resonance, were similar to those of polymer/hollow glass microsphere composite foams. At 25°C and under 1–100 Hz forced resonance, the first-order and second-order resonance frequencies of the composite foams shifted to the low-frequency region as the volume fraction of hollow polymer microspheres increased. Meanwhile, the first-order and second-order loss factors of the as-prepared composite foams were improved by 41.7% and 103.3%, respectively, compared with the pure epoxy resin. Additionally, the first-order and second-order loss factors of the as-prepared composite foams reached a maximum at 40 vol% and 30 vol% hollow polymer microspheres, respectively. This research helps us to expand the application range of composite foam materials in damping research.

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Transport Properties of One-Step Compression Molded Epoxy Nanocomposite Foams

Cited by 7 publications

References 42 publications

Temperature Rise of an Adhesive Particle-Reinforced Polymer during Fatigue Testing

Temperature Rise of an Adhesive Particle-Reinforced Polymer during Fatigue Testing

High Performance Shape Memory Epoxy Syntactic Foam Composites as Lost Circulation Material in Deep Drilling

Dynamic mechanical behaviors of epoxy resin/hollow polymeric microsphere composite foams under forced non-resonance and forced resonance

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