2016
DOI: 10.1016/j.carbon.2016.07.052
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Transparent and flexible films of horizontally aligned carbon nanotube/polyimide composites with highly anisotropic mechanical, thermal, and electrical properties

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Cited by 66 publications
(27 citation statements)
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“…In general, the responsibility of heat dissipation is appointed to polymer matric composites, known as electronic packaging materials, which possess high TC while being dielectric [26,27,35]. To meet the required features for real-time practicality, highly thermal conductive fillers such as ceramic fillers h-BN, silicon carbide (SiC) [36,37], silicon nitride (Si 3 N 4 ) [38], aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ) [39]), carbon-based fillers (carbon nanotube (CNT) [40], graphene [41], diamond [42], carbon fiber [43]), and metal fillers (silver nanowires [44], copper [45], aluminum [46]) have been extensively used to yield thermally conductive polymer composites. High electrical conductivity of carbon-based materials, metal oxides, and metals as fillers also increases the electrical conductivity of the final composite, leading to delayed signal propagation in electronic devices and restrict their application in electronic industry.…”
Section: Fabrication Of H-bn-reinforced Polymer-based Compositesmentioning
confidence: 99%
“…In general, the responsibility of heat dissipation is appointed to polymer matric composites, known as electronic packaging materials, which possess high TC while being dielectric [26,27,35]. To meet the required features for real-time practicality, highly thermal conductive fillers such as ceramic fillers h-BN, silicon carbide (SiC) [36,37], silicon nitride (Si 3 N 4 ) [38], aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ) [39]), carbon-based fillers (carbon nanotube (CNT) [40], graphene [41], diamond [42], carbon fiber [43]), and metal fillers (silver nanowires [44], copper [45], aluminum [46]) have been extensively used to yield thermally conductive polymer composites. High electrical conductivity of carbon-based materials, metal oxides, and metals as fillers also increases the electrical conductivity of the final composite, leading to delayed signal propagation in electronic devices and restrict their application in electronic industry.…”
Section: Fabrication Of H-bn-reinforced Polymer-based Compositesmentioning
confidence: 99%
“…Carbon nanotubes (CNTs), one of the most popular carbon‐based devices, have been investigated thoroughly over the past several decades for their potential applications including field‐effect transistors, interconnects, electron field emitters, sensors, and energy storage and energy conversion devices. [ 1–4 ] Although the thermal conductivity of polymer matrix reinforced by CNTs improves when CNTs are randomly distributed, due to their large aspect ratio and the strong Van der Waals force between the CNTs and the medium, they tend to aggregate and form clusters in the nano‐composite. [ 5,6 ]…”
Section: Introductionmentioning
confidence: 99%
“…with enhanced properties thus creating novel materials and innovations in broad areas from energy storage to medical diagnostics and therapy [5]- [9].…”
Section: Introductionmentioning
confidence: 99%