Transmission electron microscopy observation of thin foil specimens prepared by means of a focused ion beam

Abstract

Articles you may be interested inPreparation of transmission electron microscopy cross-section specimens using focused ion beam milling Preparation of site specific transmission electron microscopy plan-view specimens using a focused ion beam system J.Broad ion beam milling of focused ion beam prepared transmission electron microscopy cross sections for high resolution electron microscopy Proposals for exact-point transmission-electron microscopy using focused ion beam specimen-preparation technique J.A plasma-polymerized protective film for transmission electron microscopy specimen preparation by focused ion beam etching Recent development in the application of a focused ion beam to preparation of thin foil specimens for transmission electron microscopy observation has been reviewed. It has been shown that this technique is very powerful for characterization of a variety of industrial materials.

Preparation of transmission electron microscopy cross-section specimens using focused ion beam milling

“…11,12 The ability to mill and deposit metals and insulators in user defined areas makes FIB systems ideal for micro and nanoengineering. Currently, such systems are used for micromachining, 13,14 circuit modifications, 15,16 site specific cleaving, 17 failure analysis, 18 repair of electron beam and x-ray masks, 19,20 ion beam lithography, 21,22 and preparation of transmission electron microscopy ͑TEM͒ cross-section specimens, 23,24 with other applications such as the preparation of atom probe specimens and 3D reconstruction being developed. In this article, we discuss the preparation of TEM cross-section specimens using a FIB system, a technique which provides numerous advantages over conventional TEM sample preparation methods such as dimpling and broad ion beam ͑BIB͒ thinning.…”

Preparation of site specific transmission electron microscopy plan-view specimens using a focused ion beam system

“…[1][2][3][4][5] One of the advantages of using FIB milling is that a cross-section specimen can be positioned to within Ϯ 50 nm of a specific site. There are currently two FIB techniques generally used for the preparation of cross-section specimens: the ''trench'' technique 6,7 and the ''lift-out'' technique.…”

Mechanical deformation of InP and GaAs by spherical indentation

“…This technique has been used previously to create XTEM samples of indentations in silicon. 9,13 To protect the surface of the samples during the ion milling process a ϳ2 m thick layer of platinum was deposited over the surface of the indents using the FIB instrument. The TEM used in this study was a Philips EM 430 operated at an accelerating voltage of 300 kV.…”