“…The interconnect media for the high-speed integrated circuits is becoming an important task for the electronic circuit designer at different levels, especially at the printed circuit board (PCB), the backplanes, the chip to chip, and the multichip designs. Many contributors have treated this subject; in [1] Paul gives an overview of the multi-conductor transmission lines (MTL) for electro-magnetic compatibility (EMC) applications; Nitsch et al [2] have investigated analytically the uniform MTL; Griffith et al [3] have investigated non-linear circuits using a mixed frequency and time-domain analysis; in [4], Nakhla et al have investigated the MTL with non-linear terminations by delay extraction-based sensitivity; in [5], Winkelstein et al have simulated a complex lossy multiport transmission lines terminated with a non-linear digital device. The interconnecting analysis would give an optimum design with a minimum transmission line effects such as the attenuation and impedance mismatching, as well for analog and digital systems; for example, the interconnect should not introduce any delay and should not modify, in particular, clock signals; also the recent developed mixed analog and digital electronic blocks require less power consumption; high-speed interconnects have been treated and simulated with a convolution-based hierarchical packaging simulator [6].…”