Transient liquid phase bonding of Sn-Pb solder with added Cu particles
Jiaxing Wang,
Pengrong Lin,
Quanbin Yao
et al.
Abstract:In this paper, the 1%-20% Cu particles were uniformly distributed in SnPb solder by mechanical mixing method to prepare composite solder. The solder was welded by eutectic welding and the high temperature failure test was carried out. The melting point and internal structure of solder were observed before reflow, after welding and after aging, and the existence of high-temperature resistant skeleton was found. It could be seen from the DSC curve that the solder absorption peak changes in a step-like manner, an… Show more
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