Transient liquid phase bonding of Cu@Sn core–shell particles with added Sn–3.0Cu–0.5Ag

Wang, Jintao; Zhang, Luobin; Duan, Fangcheng; Wang, Fengyi; Zhang, Weiwei; Xu, Kexin; Hang, Chunjin; Chen, Hongtao

doi:10.1007/s10853-022-07013-1

J Mater Sci

2022

DOI: 10.1007/s10853-022-07013-1

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Transient liquid phase bonding of Cu@Sn core–shell particles with added Sn–3.0Cu–0.5Ag

Jintao Wang

Luobin Zhang

Fangcheng Duan

et al.

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Transient liquid phase bonding of Cu@Sn core–shell particles with added Sn–3.0Cu–0.5Ag

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