Abstract:Transient liquid phase (TLP) bonding of 6063 aluminum alloy (Al-6063) and duplex alloy 2304 stainless steel (UNS S32304) was performed using copper foil as an interlayer between the base metals. A compression load was applied normal to the specimens. Metallurgical examination of the produced joints showed three distinct regions including a reaction zone, diffusion affected zone, and the base metals. The diffusion of copper into aluminum resulted in an Al–Cu eutectic structure. However, the oxide layer on the a… Show more
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