Transient Liquid Phase Bonding

Holaday, John R.; Handwerker, Carol A.

doi:10.1007/978-3-319-99256-3_9

Cited by 2 publications

(2 citation statements)

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“…The main advantage is that the melting point of the resulting connecting alloy is significantly higher than the process temperature of the bonding process. It is used, for example, in microelectronic packaging for high-temperature applications [ 20 ]. TLP bonding is described in detail in [ 18 , 19 , 20 , 21 ].…”

Section: Methodsmentioning

confidence: 99%

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Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane

Schwenck

Grözinger

Günther

et al. 2021

Sensors

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Essential quality features of pressure sensors are, among other accuracy-related factors, measurement range, operating temperature, and long-term stability. In this work, these features are optimized for a capacitive pressure sensor with a measurement range of 10 bars. The sensor consists of a metal membrane, which is connected to a PCB and a digital capacitive readout. To optimize the performance, different methods for the joining process are studied. Transient liquid phase bonding (TLP bonding), reactive joining, silver sintering, and electric resistance welding are compared by measurements of the characteristic curves and long-term measurements at maximum pressure. A scanning electron microscope (SEM) with energy-dispersive X-ray spectroscopy (EDX) analysis was used to examine the quality of the joints. The evaluation of the characteristic curves shows the smallest measurement errors for TLP bonding and sintering. For welding and sintering, no statistically significant long-term drift was measured. In terms of equipment costs, reactive joining and sintering are most favorable. With low material costs and short process times, electric resistance welding offers ideal conditions for mass production.

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Section: Methodsmentioning

confidence: 99%

“…It is used, for example, in microelectronic packaging for high-temperature applications [ 20 ]. TLP bonding is described in detail in [ 18 , 19 , 20 , 21 ].…”

Section: Methodsmentioning

confidence: 99%