Transient-liquid-phase and liquid-film-assisted joining of ceramics

Sugar, Joshua D.; McKeown, Joseph T.; Akashi, Takaya; Hong, Sung M.; Nakashima, Kouichi; Glaeser, Andreas M.

doi:10.1016/j.jeurceramsoc.2005.06.034

Cited by 55 publications

(25 citation statements)

References 31 publications

(19 reference statements)

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“…In the most closely comparable study, 99.5% pure Al 2 O 3 was diffusion bonded using a 125-mm-thick Nb foil at 1400 8C for 6 h with a 2.2 MPa applied pressure. Four-point bend tests of beams prepared in a manner similar to the specimens in this study yielded an average bend strength of %100 MPa with all failures occurring at the Al 2 O 3 /Nb interface; [32] clearly, the Ni cladding layers accelerate processing and improve the joint properties dramatically.…”

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Ultrarapid Transient‐liquid‐phase Bonding of Al₂O₃Ceramics

et al. 2008

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The vast majority of man-made structures, from skyscrapers to microelectronic devices, require joints between similar or dissimilar materials. Ideally, joining is fast, reliable, and inexpensive. Conventional joining technologies often fail to provide these characteristics for applications involving materials with fragile microstructures (e.g., nanostructures and metallic glasses) or materials intended for high-temperature applications (e.g., ultrahigh-temperature ceramics). Difficulties arise because joining temperatures are sufficiently high to degrade the microstructure, the joining time is excessive, or the use temperatures of the joined assemblies are constrained. Transient-liquid-phase (TLP) joining is an elegant means to reduce the joining temperature relative to conventional methods while retaining the potential for high-temperature use. However, TLP bonding is often time-intensive. The rapid development of strong, defect-free joints requires: (i) favorable wetting behavior to eliminate defects and (ii) rapid interdiffusion kinetics to reduce processing times. We show in this paper that Ni/Nb/Ni interlayers develop transient-liquid films that satisfy both criteria, enabling rapid, reliable, reducedtemperature TLP bonding of a model ceramic system. While the focus of this paper is on joining ultrahigh-strength Al 2 O 3 , recently we have successfully extended the method to joining Y 2 O 3 -stabilized ZrO 2 (YSZ) and ZrO 2 -toughened Al 2 O 3 (ZTA). By designing multilayer interlayers with similar wetting and interdiffusion characteristics, it should be possible to extend this novel approach to an even broader range of advanced materials combinations. Joining [1,2] methods based on welding, soldering, and brazing [3][4][5] all involve heating to form a liquid that ideally flows to fill gaps between the pieces being joined, and subsequent cooling to induce solidification of the bonding media; the joint region differs chemically and microstructurally from the materials that were joined and has a remelt temperature below the joining temperature. Typically, since joints soften well below their remelt temperature, efforts to increase the maximum use temperature employ highermelting-temperature joining media. Unfortunately, this increases the joining temperature and the likelihood of microstructural change and property degradation. Thus, it is particularly challenging to join materials, especially ceramics, which will be used at substantial fractions of their melting temperatures. TLP bonding also involves heating to form a liquid that fills the gaps between the pieces being joined, but the liquid then ''disappears'' at the bonding temperature, and the joint region remelts above the original joining temperature. [6][7][8][9][10][11][12][13] Thus, TLP bonding is capable of joining a wide range of material types at reduced temperature to mitigate property degradation, and of producing joints with higher-temperature use capability due to an increased softening temperature. However, the required time at the bonding t...

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Ultrarapid Transient‐liquid‐phase Bonding of Al₂O₃Ceramics

et al. 2008

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“…In the present work, an existing model describing the rate of interface motion during TLP bonding is refined by taking into account the finite size of the system. This has become more important in view of increased interest in brazing and joining processes involving coatings and inter-layers [7,8]. Another important application of TLP bonding is the assemblage of MEMS packages [9][10][11].…”

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confidence: 99%

Modelling of transient liquid phase bonding in binary systems—A new parametric study

Illingworth

Golosnoy

Clyne

2007

Materials Science and Engineering: A

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An established mathematical model, describing the rate at which transient liquid phase bonding (TLP bonding) progresses in binary alloy systems, is subjected to careful scrutiny. It is shown that the process can be characterised using just two dimensionless parameters. An advantage of such dimensionless characterisation is demonstrated by analysis of the solution for solidification of semi-infinite systems. It is known that analytical formulae for the rate at which the liquid region solidifies are valid only for certain restricted cases. This is investigated by numerical modelling, and the requirements for the formulae to be applicable are rationalised. Maps presented here can be used to determine whether the semi-infinite solution would provide an acceptable approximation for any given system. Information is also presented concerning optimal combinations of phase diagram characteristics, diffusivities and system dimensions required for rapid TLP solidification, which can be used to identify the best melting point depressant (MPD) materials to use for particular TLP requirements. The analysis reveals that, as a consequence of their higher solubilities, elements forming substitutional solutes in the parent plates may often allow faster TLP solidification than those forming interstitial solutes, despite the fact that the latter group normally exhibits much higher diffusivities.

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“…To improve wetting and adherence of filler metal with the surfaces in contact during the joining process it is essential that the surfaces preparation (cleanliness) and/or state condition of the materials to be joint, i.e. an effective metallization (through wetting or flow) is required (Sugar et al, 2006;Lee et al, 2006). In diffusion bonding chemical reaction takes place between the metal and the ceramics, and the properties of the reaction product layer dictate the usefulness of the bind and thus of the whole assembly at high temperature.…”

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confidence: 99%