Transient-Liquid-Phase and Liquid-Film-Assisted Joining of Ceramics

Abstract

Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point (<450°C) liquids and commercial reactive-metal brazes is described. Recent LFAJ work on joining alumina to niobium using copper films is presented.