Transient Frequency-Domain Thermal Measurements With Applications to Electronic Packaging

Frequency-domain thermal modelling of power semiconductor devices

“…In this path the extracted low pass filter from the Foster thermal network is used to model the loss behaviours flowing out of device, and the filtered loss can create correct temperature behaviours of thermal grease TCH and heat sink THA outside the devices. The two benchmark indicators ZPinTJC and GPinPout for the new thermal model can be solved in (17) and (18), and then the gain from Pin to junction temperature can be calculated in (19) (19) The bode plot of ZPinTj and time domain simulation on the same conditions of Fig. 8 are implemented on the new thermal model, as shown in Fig.…”

“…These drawbacks make the Foster type thermal model hard to be utilized for thermal design or lifetime prediction, where the external temperature and cooling conditions of power devices need to be carefully characterized. In order to improve the thermal modeling based on Foster thermal networks, a mathematical transformation is developed which can convert the Foster network to an equivalent Cauer type with the same number of RC lumps [18], [19]. Although the obvious error of the device temperature when including the cooling conditions seems to be avoided, this mathematical transformation does not regain any physical means of the internal structure of the power device, and the accuracy of the estimated device temperature still needs to be evaluated.…”

Compact thermal modeling methodology for predicting skin temperature of passively cooled devices

“…(1) can be developed using de-convolution integrals [11]. Holman [23] describes the general transient temperature solution pertinent to first-order linear systems for a system undergoing a constant power pulse.…”

Parametric evaluation of foster RC-network for predicting transient evolution of natural convection and radiation around a flat plate

“…Yang et al [1] - [2] used Foster thermal RC-networks for modeling transient heat transfer in IC's. Their goal was to answer fundamental reliability questions in package operations.…”