Transient Electrical-Thermal-Mechanical Coupling Model and Short-Circuit Failure Analysis of Wire-Bonded IGBT Module

Liu, Renkuan; Luo, Xiaorong; Wei, Jie; Huo, Yan; Deng, Gaoqiang; Wei, Yuxi; Li, Hui; Duan, Zeyu; Chen, Xianping

doi:10.1109/icept63120.2024.10668720

2024 25th International Conference on Electronic Packaging Technology (ICEPT) 2024

DOI: 10.1109/icept63120.2024.10668720

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Transient Electrical-Thermal-Mechanical Coupling Model and Short-Circuit Failure Analysis of Wire-Bonded IGBT Module

Renkuan Liu,

Xiaorong Luo,

Jie Wei

et al.

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Transient Electrical-Thermal-Mechanical Coupling Model and Short-Circuit Failure Analysis of Wire-Bonded IGBT Module

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