Transient Analysis of MLGNR Interconnects with Single Event (SE) Crosstalk Induced Effects Based on FDTD Model

Tan, Yonghong; Zhang, Pan

doi:10.1109/iaeac54830.2022.9930037

Cited by 2 publications

(1 citation statement)

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“…In the early integrated circuit (IC) design, an interconnect could be used as an ideal transmission line, but now with the increase of IC signal frequency and the reduction of feature size, the traditional copper (Cu) interconnect has appeared many problems like scattering effect and electromigration. In recent years, new carbon nanomaterials such as graphene and graphene nanoribbons (GNR) and carbon nanotubes (CNT) have been found, which have a longer mean free path than Cu, higher current transmission density, and better thermal conduction efficiency, which make them excellent in electrical and physical properties [1,2]. In multi-layer GNR (MLGNR), every layer shares the resistance so MLGNR has a lower per unit length (p.u.l.)…”

Section: Introductionmentioning

confidence: 99%

Performance investigation of doped multi-layer graphene nanoribbon as interconnects in modern technology nodes

Wu,

Pan

2024

J. Phys.: Conf. Ser.

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In this paper, the performance of intercalation doped multilayer graphene nanoribbons (MLGNR) with modern technology nodes is meticulously investigated. An unconditionally stable FDTD method is used to analyze the transient output of the circuit. Several cases of MLGNR interconnects under different doping materials, stacking directions and contact modes have been discussed. With multiple experiments carried out, it is shown that the Li-doped MLGNR interconnect with vertical stacking orientation has the most outstanding performance, which has the least delay compared with the traditional Cu interconnect and other counterparts in 3-nm and 5-nm nodes. In summary, the Li-doped vertically stacked MLGNR is very promising for carbon nano interconnects in the next generation of integrated circuits.

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Section: Introductionmentioning

confidence: 99%