Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition

Yeh, Chang-Lin; Tsai, Tsung-Yueh; Lai, Yi‐Shao

doi:10.1016/j.microrel.2006.09.040

Cited by 19 publications

(5 citation statements)

References 20 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The dimensions of all components are presented in Table 1. Mechanical, isotropic material, and orthotropic material properties are, respectively, presented in Tables 2 and 3 [16]. In addition, the Sn-4Ag-0.5Cu solder ball is assumed to have elastic-plastic material properties; the plastic model is expressed in terms of multi-linear isotropic hardening, where the stress related with strain for each segment of Sn-4Ag-0.5Cu solder ball is presented in 3.3 The boundary conditions and loading for the global model analysis…”

Section: Tfbga Package Modelmentioning

confidence: 99%

Optimal design of thin-profile fine-pitch ball grid array package under drop impact test

Chen

Cheng

et al. 2011

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

This article describes the board-level drop reliability of thin-profile fine-pitch ball grid array (TFBGA) subjected to Joint Electron Device Engineering Council (JEDEC) drop test conditions featuring an impact pulse profile with a peak acceleration of 1500 G and a pulse duration of 0.5 ms. The solder ball is assumed to be an elastoplastic model and the other components linear elastic ones. Both the global/local finite element and the finite grid region methods are introduced to improve the accuracy and the convergence during the meshing process. Meanwhile, the contact impact process during the drop test is translated into the effective support excitation load on the printed circuit board (PCB) through the support excitation scheme to simplify the analysis. By means of optimal parameters of the Taguchi robust design, the average stress of the solder ball at the PCB side surface becomes 80.9 MPa, which shows a 57 per cent reduction compared to the original stress of 189.7 MPa. As a result, the impact reliability of the TFBGA package is significantly improved. Finally, the JEDEC drop test is conducted to verify the optimal results obtained by the Taguchi method.

show abstract

Section: Tfbga Package Modelmentioning

confidence: 99%

Optimal design of thin-profile fine-pitch ball grid array package under drop impact test

Chen

Cheng

et al. 2011

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

show abstract

“…Similar complexities arise from modeling of the package and solder joints. Consequently, approximations and simplifications of both the geometry and material properties are often exploited to reduce the complexity of the resulting FE models in the dynamic response simulations of electronic assemblies (Yeh and Lai, 2006; Yeh et al , 2007).…”

Section: Introductionmentioning

confidence: 99%

Finite element model updating of board-level electronic packages by factorial analysis and modal measurements

Gharaibeh

2018

View full text Add to dashboard Cite

Purpose One difficultly in building an effective finite element (FE) model of a board-level package is because of complex structure of the printed circuit board (PCB), as it contains copper layers, woven fabrics, plated-through holes and so forth. Therefore, it is often acceptable to obtain equivalent orthotropic material properties and use them in the simulation. This paper aims to provide a research methodology to produce equivalent FE models for board-level electronic packages. Design/methodology/approach In this methodology, the FE models’ data were correlated with experimental modal analysis results in terms of natural frequencies and mode shapes. Statistical factorial analysis was used to examine the electronic assembly material properties effect on the structure’s resonant frequencies. The equivalent material properties of the PCB were adjusted using the optimization tool available in ANSYS software for free boundary conditions. The equivalent FE model was then validated for the fixed boundary conditions. Findings The resultant FE models were in great match with the measured data in terms of resonant frequencies and mode shapes. The so-developed models can be further used in the analysis of the dynamic response of the electronic packages and solder interconnects. Originality/value The current approach provides a sophisticated research methodology to provide high-accuracy FE models of electronic assemblies subjected to vibration. The main value of this approach is to first test the effect of each material property on the package dynamic characteristics before starting the correlation process, then to automate the correlation algorithm using the built-in FE model updating feature available in ANSYS software.

show abstract

“…This technology offers significant advantages in terms of electrical performances, e.g., signal transmission, interconnect density and reduced power consumption as well as form factor, heterogeneous integration, and manufacturing cost reduction. However, the TSV process has been demonstrated at the R&D level and the key technical challenges include: (1) high density and high aspect ratio via etching, (2) low temperature processes for passivation and metallization, (3) high speed via filling, (4) thinned wafer/device handling, (5) high speed and precise wafer level alignment and assembly processes, (6) testing and methodology, and (7) competitive cost [1] . The issue of reliability will become extraordinary crucial for this technology to be used in high volume production of electronic devices.…”

Section: Introductionmentioning

confidence: 99%

“…It was found that the solder joint failure was induced by the combined stress of mechanical shock and PCB bending [2] . The response spectra analysis was introduced to obtain transient structural responses of an undamped multiple degrees of freedom structural system subjected to impact acceleration pulse of a half-sine waveform by Yel et al [6] . The implicit Input-G method is adopted to simulate the board level drop test of an advanced molded leaded package (MLP) by Liu et al [7] .…”

Section: Introductionmentioning

confidence: 99%

Drop test simulation of 3D stacked-die packaging with Input-G finite element method

Chen

Wang

Liu

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

View full text Add to dashboard Cite

Transient responses of 3D stacked-die package with through silicon via (TSV) structure under board level drop test load following the JEDEC standard are investigated using the Input-G finite element simulation method. In order to reduce the finite element mesh size the stacked-die package under investigation is modeled with details while the others are simplified as blocks with equivalent material properties. The deflection and velocity responses of the stacked-die package located at center of test board are obtained. The stress and strain of the copper via, and micro solder pumps and silicon dies are checked and compared. The simulation results show that the critical position is located at the corner of bottom layer of copper via, copper pad and micro solder bumps. The logarithmic strain evolutions of critical copper pad and micro solder bump are investigated.

show abstract

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition

Cited by 19 publications

References 20 publications

Optimal design of thin-profile fine-pitch ball grid array package under drop impact test

Optimal design of thin-profile fine-pitch ball grid array package under drop impact test

Finite element model updating of board-level electronic packages by factorial analysis and modal measurements

Drop test simulation of 3D stacked-die packaging with Input-G finite element method

Contact Info

Product

Resources

About