Transfer printing of flexible hybrid inductor-capacitor filters via pre-etched silicon-on-insulator mother wafer

Pang, Liang; Seo, Hui Chan; Kim, Kyekyoon Kevin

doi:10.1063/1.4742341

Cited by 3 publications

(2 citation statements)

References 18 publications

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“…These rolled-up SiN x nanomembrane inductors can further be transfer-printed and rearranged at will on wafers with predesigned RFICs. 24,25 When AC current flows in and out the feedlines, time varying electromagnetic field will be triggered. Because the SiN x thickness t SiN (typically ∼40 nm) is very small compared to the tube radius R 1 (typically 0.5−5 μm), the radius change of each turn of the spiral structure is negligible.…”

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confidence: 99%

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On-Chip Inductors with Self-Rolled-Up SiN_x Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization

Huang

Froeter

et al. 2012

Nano Lett.

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Inductors are essential components of radio frequency integrated circuits (RFICs). While the active devices in RF systems downscale steadily, inductors have not been able to keep up with the pace of continual miniaturization because of the trade-off between size and performance as well as fabrication complexity. Strain-induced self-rolled-up nanotechnology allows the formation of three-dimensional (3D) architectures, such as multiple-turn spiral tubes, through planar processing. Here, we report on using 3D SiN(x) tubular structures with accompanying prepatterned metal layers, as a novel on-chip tube inductor design platform. We found, by an equivalent lumped circuit and electromagnetic modeling, that the 3D metal spiral structure has the ability to significantly better confine magnetic field compared to conventional planar spiral on-chip inductors. More than 100× reduction in footprint can be realized using this platform while achieving excellent electrical performance, including large inductance, high quality (Q) factor, and high self-resonance frequency (f(0)).

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confidence: 99%

“…However, single-cell structure can be used together with other serially connected tube-based passive components. These rolled-up SiN x nanomembrane inductors can further be transfer-printed and rearranged at will on wafers with predesigned RFICs. , …”

mentioning

confidence: 99%

On-Chip Inductors with Self-Rolled-Up SiN_x Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization

Huang

Froeter

et al. 2012

Nano Lett.

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On the operating mechanisms of flexible microwave inductors and capacitors under mechanical bending conditions

Yang¹,

Lan²,

You³

et al. 2021

J. Phys. D: Appl. Phys.

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Flexible microwave passive components play an important role in flexible integrated circuits, especially for high-speed wireless communication systems. It is clear that bending can have a significant impact on the flexible components' performance. However, an analysis of the physical mechanisms of flexible microwave passive components under mechanical bending conditions has not been completed. In this paper, we describe a study of the performance variations and operating mechanisms of flexible microwave inductors and capacitors under mechanical bending conditions. Flexible spiral inductors and metal-insulator-metal capacitors of various dimensions were fabricated on plastic substrates and measured under different mechanical bending conditions. Modeling of the flexible components was conducted. The influence of mechanical bending on flexible inductors and capacitors was characterized based on experimental and modeled results. The underlying operational mechanisms of flexible inductors and capacitors under bending conditions are discussed using the distributions of the electric and magnetic fields from the model. In addition, the performance variations with different component parameters (e.g. the metal and substrate materials, the thicknesses of the metals and dielectrics) were studied under bending conditions. The results are helpful for the use of flexible microwave passive components in flexible microwave monolithic integrated circuits.

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Design of Metal Membrane Stress Driven Microtube Microwave L-C Resonators

Xia,

Zhang,

Gong

et al. 2024

2024 7th International Conference on Electronics Technology (ICET)

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Transfer printing of flexible hybrid inductor-capacitor filters via pre-etched silicon-on-insulator mother wafer

Cited by 3 publications

References 18 publications

On-Chip Inductors with Self-Rolled-Up SiN_x Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization

On-Chip Inductors with Self-Rolled-Up SiN_x Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization

On the operating mechanisms of flexible microwave inductors and capacitors under mechanical bending conditions

Design of Metal Membrane Stress Driven Microtube Microwave L-C Resonators

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Transfer printing of flexible hybrid inductor-capacitor filters via pre-etched silicon-on-insulator mother wafer

Cited by 3 publications

References 18 publications

On-Chip Inductors with Self-Rolled-Up SiNx Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization

On-Chip Inductors with Self-Rolled-Up SiNx Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization

On the operating mechanisms of flexible microwave inductors and capacitors under mechanical bending conditions

Design of Metal Membrane Stress Driven Microtube Microwave L-C Resonators

Contact Info

Product

Resources

About

On-Chip Inductors with Self-Rolled-Up SiN_x Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization

On-Chip Inductors with Self-Rolled-Up SiN_x Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization