2019
DOI: 10.1002/adfm.201908018
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Traditional Dough in the Era of Internet of Things: Edible, Renewable, and Reconfigurable Skin‐Like Iontronics

Abstract: With the rapid development of Internet of Things technology, interactive interfaces that can promote bidirectional communications between human beings and machines will certainly play an important role. Current electronic or iontronic systems meet diverse requirements such as conductivity, mechanical compliance, stimuli responsiveness, long‐time duration, and even biocompatibility. However, for future large‐scale applications, non‐degradable and non‐recyclable components in these devices cause resource waste a… Show more

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Cited by 53 publications
(51 citation statements)
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“…It is widely acknowledged that when wheat dough being teared, dough fragments can be rolled up and kneaded, thus making a reshaped dough without obvious performance degradation 11 . The principle behind it is the dynamic construction of and conversion between S-S bonds and free -SH groups together with the assistance of intramolecular and intermolecular H-bonds involved in the gluten network rebuilding process.…”
Section: Self-healing Ability and Biocompatibility Of E-gesmentioning
confidence: 99%
See 1 more Smart Citation
“…It is widely acknowledged that when wheat dough being teared, dough fragments can be rolled up and kneaded, thus making a reshaped dough without obvious performance degradation 11 . The principle behind it is the dynamic construction of and conversion between S-S bonds and free -SH groups together with the assistance of intramolecular and intermolecular H-bonds involved in the gluten network rebuilding process.…”
Section: Self-healing Ability and Biocompatibility Of E-gesmentioning
confidence: 99%
“…Upon hydration and kneading, gluten is known to form a cross-linked three-dimensional protein polymeric network through intra-and inter-molecular covalent and noncovalent bonds. The gluten network possesses various dynamic bonds, like dynamic covalent disul de (S-S) bonds and noncovalent H-bonds, thus guaranteeing the self-healing ability that most SF-based e-skin loses 1,[9][10][11][12] . Generally, for eskin preparation, the macroscopic mechanical performances of synthetic materials, like supramolecular polymers, can be adjusted by constructing cross-linking positions inside the microscopic network structure [13][14][15] .…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, physically cross-linked hydrogels with self-healability and flexibility that can adapt to dynamic surfaces have been recently developed. However, these systems showed poor structural integrity, insufficient anti-fatigue properties, and plastic deformation under external force, which can compromise the materials stability and functionality of the ionic skins[ 8 - 11 ]. Therefore, it is still a challenge to develop hydrogel-based electronic sensors as ionic skins that feature the combined attributes of adaptability, high elasticity, and stretchability.…”
Section: Introductionmentioning
confidence: 99%
“…[14][15][16] Besides, as the overheating issues in electronic devices become prominent, if the traditional plastic packages for the electronic devices can be replaced with efficient cooling and recyclable plastics, it is also beneficial to alleviate the environmental and resource crisis. [17][18][19][20] Herein, this work opens an environmentally sustainable pathway to address the thermal issues encountered in building-level and electronics' thermal management. A type of reconfigurable and renewable plastics is reported with tailored nano-micro structures for radiative cooling.…”
Section: Introductionmentioning
confidence: 99%