“…Since we use about 2 mL of solution in each half cell, m =2.6 g. Hence, Equation (2) indicates that the temperature of the solution increases by around 9 °C during etching. Since the etch rate for polycarbonate is strongly dependent on temperature27 (e.g., an increase of temperature from 45 to 55 °C results in a threefold increase of the etching rate), a substantial increase in etch rate is, indeed, expected when 30 V is applied relative to the case when no transmembrane potential is applied during etching. Furthermore, these calculations assume that the heat generated is dissipated instantaneously throughout the entire volume of the half‐cell solution, but this is undoubtedly not true as the heat is generated within the pore.…”