Track-etch membranes enabled nano-/microtechnology: A review

Chakarvarti, S. K.

doi:10.1016/j.radmeas.2009.10.028

Cited by 65 publications

(18 citation statements)

References 41 publications

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“…Nowadays, ion track membranes, also known as nuclear track filters, have emerged as the main offshoot from SSNTDs. Many applications of SSNTDs have been developed, including biological filters, detection of light ions, dosimetry to use in ion track etching, magnetic nano wires as magneto resistive sensors and much more [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%

Gamma irradiation induced chemical and structural modifications in PM-355 polymeric nuclear track detector film

Kumar

Sonkawade²,

Dhaliwal

2012

Nuclear Instruments and Methods in Physics Research Section B:

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Section: Introductionmentioning

confidence: 99%

Gamma irradiation induced chemical and structural modifications in PM-355 polymeric nuclear track detector film

Kumar

Sonkawade²,

Dhaliwal

2012

Nuclear Instruments and Methods in Physics Research Section B:

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“…However, such synthesis techniques cannot be applied on substrates which do not fulfil the specific requirements dictated by the growth mechanism. Unlike AAO templates, which involve a limited pore density around 10 9 cm −2 , the ion track-etching technique produces randomly arranged cylindrical pores of ten to several hundreds of nm in diameter [33] and varying densities between 10 5 and 10 10 cm −2 . Many research works have been initiated in order to establish such a nanofabrication process on several types of polymer, such as PC [21], PI or polyester [21][22][23].…”

Section: Introductionmentioning

confidence: 99%

Poling Field Dependence of Longitudinal and Transverse Wave Velocities, Young's Modulus, and Poisson's Ratio in Piezoelectric Ceramics

Ogawa¹,

Ishii²,

Matsumoto³

et al. 2012

Jpn. J. Appl. Phys.

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The interest of using polyimide as a sacrificial and anchoring layer is demonstrated for post-processing surface micromachining and for the incorporation of metallic nanowires into microsystems. In addition to properties like a high planarization factor, a good resistance to most non-oxidizing acids and bases, and CMOS compatibility, polyimide can also be used as a mold for nanostructures after ion track-etching. Moreover, specific polyimide grades, such as PI-2611 from HD Microsystems TM , involve a thermal expansion coefficient similar to silicon and low internal stress. The process developed in this study permits higher gaps compared to the state-of-the-art, limits stiction problems with the substrate and is adapted to various top-layer materials. Most metals, semiconductors or ceramics will not be affected by the oxygen plasma required for polyimide etching. Released structures with vertical gaps from one to several tens of μm have been obtained, possibly using multiple layers of polyimide. Furthermore, patterned freestanding nanowires have been synthesized with diameters from 20 to 60 nm and up to 3 μm in length. These results have been applied to the fabrication of two specific devices: a generic nanomechanical testing lab-on-chip platform and a miniaturized ionization sensor.(Some figures may appear in colour only in the online journal) Polyimide (PI) is often selected for its high planarization factor, CMOS compatibility, tolerance to most chemical products used in microfabrication, and chemical resistance up to high temperatures. Moreover, depending on its formulation, PI can be spin-coated with thicknesses as high as several tens of μm and as low as 200 nm by diluting the precursor solution in its solvant [8]. A large range of possible gaps is thus allowed between a top movable clamped-clamped membrane or beam and a fixed bottom electrode lying on the substrate. New formulations of PI show additional interesting properties such as a thermal expansion coefficient similar to silicon (Si),

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“…Copper nanowires of diameter 80 nm were synthesized using template-assisted method via electrodeposition (Chakarvarti, 2009). A two-electrode electrochemical cell was used for electrodeposition that was poured with aqueous solution of 1 M CuSO 4 $5H 2 O. pH of the solution was adjusted with the help of H 2 SO 4 .…”

Section: Synthesismentioning

confidence: 99%