Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM

Thermal performance of a phase change material-based heat sink in presence of nanoparticles and metal-foam to enhance cooling performance of electronics

“…Moreover, the difference between LTE and LTNE depends on the initial and boundary conditions which are more prominent while sensible heating mode rather than phase-change process due to having an most constant temperature. In addition, it is notable that, the LTNE model cannot be applied in 2D and axisymmetric models because of the generation of porous boundaries at the walls between the heat sink and PCM and limitation of coupled boundary condition for it in FLUENT software [31]. Thus, the energy equation with LTE is modelled as follows:…”