Towards the Extension of TRIC for Thermo-Mechanical Analysis

Codecasa, Lorenzo; Costanzo, Antonio; d’Alessandro, V.; Duca, Roseanne; Gualandris, D.; Morelli, Arianna; Viti, F. De; Villa, Claudio Maria

doi:10.1109/therminic52472.2021.9626532

“…Previously, Eblen [4] carried out a coupled thermomechanical analysis-based reliability study of electronics components with the help of FEM and CARES, a computing tool for reliability assessments. Thermomechanical analysis of an electronic package was presented by Codecasa et al [5], focusing on reducing computing time with TRIC, a projection-based solver. Coupled thermomechanical analysis has been extended to electrical-thermal-mechanical analysis to study an electrical contact site by Shen and Ke [6].…”

Section: Introductionmentioning

confidence: 99%

Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction

Hassan,

Rajaguru,

Stoyanov

et al. 2024

IMAPSource Proceedings

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This paper presents parametric model order reduction (pMOR) by the Lagrange approach of matrix interpolation for the thermal-mechanical and reliability study of a power electronics module (PEM) with nonlinear behaviours. Most previous research in model order reduction (MOR) studies reports thermal-mechanical simulations using a sequentially coupled method. In this research, a direct-coupled thermal-mechanical analysis, which simultaneously solves the thermal and structural governing equations, has been used to obtain thermal and deformation results. Furthermore, for pMOR, the linear approach of matrix interpolation is limited to linear changes between sampled-parametric points. Hence, a new way of interpolating system matrices using the Lagrange interpolation method has been adopted to implement the matrix interpolation efficiently. The parametric reduced-order model (pROM) solution by the Lagrange approach of matrix interpolation agrees well with the full-order model (FOM) and takes similar computational time as the linear (bi-linear) approach of matrix interpolation. pROM simulations offer up to 85.5% reduction in computational time.

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“…Thermal-mechanical analysis-based reliability assessment had been previously conducted with FEM and CARES, a reliability assessment computational tool, by Eblen [10] for microelectronic package designing. Codecasa et al [11] presented a computational tool, TRIC, a multigrid and ad-hoc projection-based solver to reduce simulation time for necessary thermal-mechanical analysis in electronic packaging. Shen and Ke [12] investigated an electrical contact region by electrical-thermal-mechanical coupled analysis.…”

Section: Introductionmentioning

confidence: 99%

Parametrising Temperature Dependent Properties in Thermal-Mechanical Analysis of Power Electronics Modules using Parametric Model Order Reduction

Hassan

¹

,

Rajaguru

²

,

Stoyanov

³

et al. 2023

2023 46th International Spring Seminar on Electronics Technology (ISSE)

1

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In this paper, a direct-coupled thermalmechanical analysis of a Power Electronics Modules (PEM) using ANSYS-FEM (Finite Element Method) is integrated with a Parametric Model Order Reduction (pMOR) technique. Unlike most present studies on model order reduction, which perform the coupled thermal-mechanical analysis by sequentialcoupled thermal-mechanical models, the direct-coupled thermal-mechanical approach deployed in this study solves the thermal and structural models simultaneously. Commonly, pMOR mainly focuses on parametrising model parameters (e.g., material properties, loads.) that are constants. In this investigation, a new approach to parametrise temperaturedependent properties using pMOR, such as the coefficient of thermal expansion (CTE) of the materials in PEM structures, has been demonstrated in the context of the reliability assessment of electronic modules. A two-dimensional finite element model of a PEM is developed and used to study the temperature-dependent CTE effects of the Aluminium (Al) alloy on the thermal-mechanical response of the system under thermal load. A Krylov subspace-based technique, PRIMA, has been used for the model order reduction and a linear approach of matrix interpolation for the parametrisation in the pMOR. The full-order state-space model has 30,612 degrees of freedom (DOFs), and the reduced model achieved by pMOR has just 8 DOFs. The simulation runs show that with this approach, a substantial reduction in computational time can be achieved, for this problem, by 81% between the full and the reduced order models. In modelling predictions, the pMOR-based solution has retained the accuracy of results. In this instance, the average difference in stress result, compared to the ANSYS-FEM model (FOM) solution, is only 0.43%.

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Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction

Hassan,

Rajaguru,

Stoyanov

et al. 2023

2023 24th European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC)

0

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This paper presents parametric model order reduction (pMOR) by the Lagrange approach of matrix interpolation for the thermal-mechanical and reliability study of a power electronics module (PEM) with nonlinear behaviours. Most previous research in model order reduction (MOR) studies reports thermal-mechanical simulations using a sequentially coupled method. In this research, a direct-coupled thermal-mechanical analysis, which simultaneously solves the thermal and structural governing equations, has been used to obtain thermal and deformation results. Furthermore, for pMOR, the linear approach of matrix interpolation is limited to linear changes between sampled-parametric points. Hence, a new way of interpolating system matrices using the Lagrange interpolation method has been adopted to implement the matrix interpolation efficiently. The parametric reduced-order model (pROM) solution by the Lagrange approach of matrix interpolation agrees well with the full-order model (FOM) and takes similar computational time as the linear (bi-linear) approach of matrix interpolation. pROM simulations offer up to 85.5% reduction in computational time.

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Towards the Extension of TRIC for Thermo-Mechanical Analysis

Cited by 3 publications

References 55 publications

Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction

Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction

Parametrising Temperature Dependent Properties in Thermal-Mechanical Analysis of Power Electronics Modules using Parametric Model Order Reduction

Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction

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