2016
DOI: 10.1016/j.carbon.2015.09.060
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Towards scalable fabrication of ultrasmooth and porous thin carbon films

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Cited by 12 publications
(14 citation statements)
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References 46 publications
(38 reference statements)
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“…Polyacrylonitrile (PAN) has wide applications in fibers for textiles and oxidant flame‐retardant fibers due to its excellent mechanical property, thermal stability, and processability . It is also one of the major precursors for carbon materials because of its relatively high carbon yield and formability . Possessing high mechanical strength, excellent electrical conductivity and stability, the PAN‐based carbon materials (fibers and films) were used in various fields such as advanced composites, electromagnetic shielding, electronics, and structural sectors .…”
Section: Introductionmentioning
confidence: 99%
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“…Polyacrylonitrile (PAN) has wide applications in fibers for textiles and oxidant flame‐retardant fibers due to its excellent mechanical property, thermal stability, and processability . It is also one of the major precursors for carbon materials because of its relatively high carbon yield and formability . Possessing high mechanical strength, excellent electrical conductivity and stability, the PAN‐based carbon materials (fibers and films) were used in various fields such as advanced composites, electromagnetic shielding, electronics, and structural sectors .…”
Section: Introductionmentioning
confidence: 99%
“…It is also one of the major precursors for carbon materials because of its relatively high carbon yield and formability . Possessing high mechanical strength, excellent electrical conductivity and stability, the PAN‐based carbon materials (fibers and films) were used in various fields such as advanced composites, electromagnetic shielding, electronics, and structural sectors . The properties of carbon materials mainly depend on the carbon structure in the products .…”
Section: Introductionmentioning
confidence: 99%
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“…Porous carbon can be produced by various means. The techniques using high-temperature treatment of an organic precursor [17,18] are not suitable for every substrate, though. Bouts et al [19] presented a concept based on the removal of copper from a copper-containing DLC film.…”
Section: Introductionmentioning
confidence: 99%
“…The average film thickness was found to be 89. Peng et al [319] reported the use of 1,1,1,3,3,3-hexafluoro-2-propanol (HFIP) as solvent to prepare PAN polymer thin films with nano-scale roughness and controllable thickness by the dip coating process. HFIP is a highly volatile solvent with very low boiling point (59 °C), which is capable of dissolving PAN homopolymer as well as St-AN copolymers with high AN compositions.…”
Section: Preparation Of Thin Films Of St-an Copolymersmentioning
confidence: 99%