Towards On-Chip Measurement of S-Parameters for Ultrasonic Guided-Wave SHM: Damage Localization in Aluminum Using S-Parameter Measurements

Nyikayaramba, Gift; Murmann, Boris

doi:10.12783/shm2019/32246

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2020

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“…Our recent conference publication demonstrated, for the first time, the use of S-parameter measurements for the localization of defects in an aluminum test structure [17]. In this paper, we extend this work to also show S-parameter-based defect localization in a carbon-fiber-reinforced polymer (CFRP) test structure and then leverage the insights we gain to propose a frequency-domain-based on-chip system for ultrasonic SHM.…”

Section: Introductionmentioning

confidence: 75%

S-Parameter-Based Defect Localization for Ultrasonic Guided Wave SHM

Nyikayaramba

Murmann

2020

Aerospace

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In this work, an approach for enabling miniaturized, low-voltage hardware for active structural health monitoring (SHM) based on ultrasonic guided waves is investigated. The proposed technique relies on S-parameter measurements instead of time-domain pulsing and thereby trades off longer measurement times with lower actuation voltages for improved compatibility with dense complementary metal-oxide-semiconductor (CMOS) chip integration. To demonstrate the feasibility of this method, we present results showing the successful localization of defects in aluminum and carbon-fiber-reinforced polymer (CFRP) test structures using S-parameter measurements. The S-parameter measurements were made on benchtop vector network analyzers that actuate the piezoelectric transducers at output voltage amplitudes as low as 1.264 Vpp.

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Section: Introductionmentioning

confidence: 75%