Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2014
DOI: 10.1109/itherm.2014.6892394
|View full text |Cite
|
Sign up to set email alerts
|

Towards development of a passive datacenter cooling technology: On-server thermosyphon cooling loop under dynamic workload

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
8
0

Year Published

2015
2015
2021
2021

Publication Types

Select...
5
2

Relationship

1
6

Authors

Journals

citations
Cited by 11 publications
(9 citation statements)
references
References 36 publications
1
8
0
Order By: Relevance
“…3.4. The present manuscript follows the simulation approach already presented in Marcinichen et al (2014).…”
Section: Simulationsmentioning
confidence: 99%
“…3.4. The present manuscript follows the simulation approach already presented in Marcinichen et al (2014).…”
Section: Simulationsmentioning
confidence: 99%
“…As investigated previously by Marcinichen et al (2014 and performed another parametric study on thermosyphon height and riser and downcomer diameters. However, for this application, the height was much bigger, as the authors studied heights of 50, 75 and 100 cm.…”
Section: Geometric Parametersmentioning
confidence: 98%
“…Throughout the whole simulations, the system was able to keep the chip's temperature below 85°C and without the risk of dry out. Szczukiewicz et al (2015) added to the work of Marcinichen et al (2014) by carrying out a thermo-economic analysis of a double thermosyphon loop system applied to a datacenter rack. The findings of the study provided by the authors are described in detail later in the thermo-economic analysis section.…”
Section: Modelingmentioning
confidence: 99%
See 2 more Smart Citations