Toughening of cyanate resin with low dielectric constant by glycidyl polyhedral oligomeric silsesquioxane

Abstract

In this article, a high-performance hybrid material was prepared by melt blending from glycidyl polyhedral oligomeric silsesquioxane (G-POSS) and bisphenol-A cyanate ester (CE), using triethylamine as the curing agent. The structure of the hybrid was characterized by Fourier transform infrared spectroscopy and scanning electron microscopy (SEM), and the transparency properties, mechanical properties, dielectric properties, thermal performance, and wet fastness were studied. The results showed that G-POSS was uniformly distributed in the CE matrix and could obviously accelerate the curing reaction of the resin. Large amounts of corrugated and scaled structures were observed on the fractures of G-POSS/CE by the SEM photos. When the G-POSS content increased to 7 phr, the tensile strength (75.45 MPa), elongation at break (3.19%), and impact strength (23.76 kJ m−2) reached maximum values, representing increases of 21.75%, 27.6%, and 157.98% relative to that of pure CE, respectively, which indicated that the addition of G-POSS can significantly improve the toughness of G-POSS/CE composites. When the G-POSS content increased to 4 phr, the dielectric constant decreased from 3.27 to the minimum value of 3.05. The heat resistance and wet fastness of G-POSS/CE hybrid materials decreased with increasing G-POSS content.

Enhanced toughness and lowered dielectric loss of reactive POSS modified bismaleimide resin as well as the silica fiber reinforced composites

“…Due to the presence of multiple organic groups in the POSS, the compatibility between BD and G‐POSS or MA‐POSS increases, making it evenly distributed in the hybrid resins at molecular level, which means that rigid inorganic nano‐scale SiOSi core is uniformly dispersed. [ 40 ] Therefore, the distance among molecular chain is enlarged and the chain segment is easier to move. Besides, the SiOSi cores disperse the stresses concentrated on crack tip and induce crazing, which prolongs the crack failure path, absorbs more fracture energy and result in inhibiting the crack extension.…”

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

“…In addition, G-POSS demonstrates an exceptionally low dielectric constant. Jiao et al [183] accomplished the fabrication of high-performance G-POSS/CE composites via melt blending and subsequent curing of G-POSS with bisphenol A cyanate ester. By incorporating MPS with POSS, the composite system simultaneously benefited from the combined effects on the polymer matrix, leading to notable improvements in dielectric properties, mechanical properties, and thermal properties.…”

Recent progress on polyphenylene oxide-based thermoset systems for high-performance copper-clad laminates

“…Even though the modified epoxy with enhanced performance is being widely investigated, the polar hydroxyl groups in the cured epoxy resins still lead to high dielectric constant (D k ) and D f [27][28][29][30][31][32]. CE has also been well investigated and normally combined with other resins, which possess good dielectric properties (D f ∼ 0.006@1 GHz), heat resistance, and mechanical properties [33][34][35][36][37][38][39][40][41][42][43][44][45][46]. The critical shortage of CE resin is its sensitivity to moisture, especially during the curing process.…”