Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique

Yap, H. H.; Tan, Puay Siew; Low, G.R.; Dawood, M. K.; Feng, Huanhuan; Zhao, Yuzhe; He, Rujie; Tan, H.; Zhu, Jie; Liu, B.; Huang, Yuanyuan; Wang, D. D.; Lam, Jeffrey; H., Z.

doi:10.1016/j.microrel.2015.06.037

Cited by 11 publications

(6 citation statements)

References 5 publications

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“…In the previous studies, sacrificial dummy as a polishing balance, platinum (Pt) as an etching mask, and lateral delayering with adapted polishing plate were used to counteract the edge effect [11][12][13]. Other studies focused on the impact of pad properties [14][15], cloth roughness [16], slurry particle size [17][18], and interaction mechanism [19][20] on the material removal rate and polishing uniformity.…”

Section: Introductionmentioning

confidence: 99%

Advanced Physical Failure Analysis Techniques for Rescuing Damaged Samples with Cracks, Scratches, or Unevenness in Delayering

Pan¹,

Tan²,

Ting³

et al. 2021

Adv. sci. technol. eng. syst. j.

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This paper is an extended version of work published in IPFA 2020. In the previous paper, advanced physical failure analysis (PFA) techniques for rescuing damaged samples with cracks, scratches, or unevenness in delayering are introduced. In the present work, the techniques will be further exploited and summarized for the potential applications in general devices. The three typical rescue cases will be fully discussed through comprehensive analysis on the failure mechanism and the rescuing process. Compared to the conventional PFA techniques that normally require back-up samples, the novel rescue techniques offer more alternative solutions for coping with sample damage problems in delayering without starting over with a new sample that would waste machine time and human resources. These new PFA techniques involve only basic failure analysis (FA) skills that could be easily manipulated and FA equipment that is commonly available in FA labs, and would extend the scope and capability of the tradition PFA to help the FA engineers deliver FA results with high quality and high success rate in the daily work, especially for handling "one of a kind" devices.

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Section: Introductionmentioning

confidence: 99%

Advanced Physical Failure Analysis Techniques for Rescuing Damaged Samples with Cracks, Scratches, or Unevenness in Delayering

Pan¹,

Tan²,

Ting³

et al. 2021

Adv. sci. technol. eng. syst. j.

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show abstract

“…Device delayering is a common failure analysis technique in which the layers are removed from top to bottom. The common delayering methods include FIB tools that yield delayered areas of 20 x 20 μm (Ga FIB tool [5][6][7]) and 100 x 100 μm (Xe plasma FIB tool [7][8][9][10]). In addition, broad ion beam (BIB) milling is effective in delayering 300 mm wafers and wafer pieces [11][12][13] and provides a large slope area on the sample that reveals all device layers.…”

Section: Introductionmentioning

confidence: 99%

Accurate Sub-micron Device Delayering of Plan View TEM Specimens By Ar Ion Milling

Bonifacio¹,

Nowakowski²,

Li³

et al. 2021

International Symposium for Testing and Failure Analysis

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With the introduction of new materials, new device structures, and shrinking device dimensions, failure mechanisms evolve, which can make identifying defects challenging. Therefore, an accurate and controllable delayering process to target defects is desirable. We present a workflow comprised of bulk device delayering by broad Ar ion beam milling, plan view specimen preparation by focused ion beam tool, followed by site-specific delayering by concentrated Ar ion beam milling. The result is an accurately delayered device, without sample preparation-induced artifacts, that is suitable for uncovering defects during physical failure analysis.

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“…The delayering technique allows top-down, whole chip characterization. The primary challenges presented by a vertical stack are looking through many dissimilar layers and attempting to investigate different layers simultaneously [3]. SEM columns and related analytical techniques meet the FA requirements of the semiconductor industry; however, sample preparation lags behind.…”

Section: Introductionmentioning

confidence: 99%

“…Top-down delayering using conventional mechanical preparation techniques is a difficult to control process that does not allow targeting of a specific depth or layer [4][5]. Gallium and xenon focused ion beam (FIB) tools have also been employed [3][4][5]; both FIB types provide a relatively small delayered area (Ga FIB, ~20 x 20 µm [4]; Xe FIB, ~100 x 100 µm [1][2]6]). These size limitations frequently prevent the preparation of a large slope area that exposes all the device layers simultaneously.…”

Section: Introductionmentioning

confidence: 99%

Large Area Semiconductor Device Delayering for Failure Identification and Analyses

Nowakowski¹,

Bonifacio²,

Ray³

et al. 2021

International Symposium for Testing and Failure Analysis

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Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique

Cited by 11 publications

References 5 publications

Advanced Physical Failure Analysis Techniques for Rescuing Damaged Samples with Cracks, Scratches, or Unevenness in Delayering

Advanced Physical Failure Analysis Techniques for Rescuing Damaged Samples with Cracks, Scratches, or Unevenness in Delayering

Accurate Sub-micron Device Delayering of Plan View TEM Specimens By Ar Ion Milling

Large Area Semiconductor Device Delayering for Failure Identification and Analyses

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