2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2023
DOI: 10.1109/therminic60375.2023.10325908
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To bend or not to bend: Impact on heat pipe performance

Wessel W. Wits,
Rick Groot,
Davoud Jafari

Abstract: Thermal management of electronics continues to be a dominant factor that needs attention already early in the design phase. Within complex systems, typically a battle for space is imminent due to the multidisciplinary nature. In this respect, the use of low-form-factor phase-transitional devices is standard industry practice nowadays. In particular, heat pipes have demonstrated high heat transfer rates, due to the utilization of a working fluid's latent heat in combination with reliable, small and lightweight … Show more

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