Tip Crack Imaging on Transparent Materials by Digital Holographic Microscopy

Abstract

With this study, we propose a method to image the tip crack on transparent materials by using digital holographic microscopy. More specifically, an optical system based on Mach–Zehnder interference along with an inverted microscopy (Olympus CKX53) was used to image the tip crack of Dammar Varnish transparent material under thermal excitation. A series of holograms were captured and reconstructed for the observation of the changes of the tip crack. The reconstructed holograms were also compared temporally to compute the temporal changes, showing the crack propagation phenomena. Results show that the Dammar Varnish is sensitive to the ambient temperature. Our research demonstrates that digital holographic microscopy is a promising technique for the detection of the fine tip crack and propagation in transparent materials.

Study of Crack Growth of Transparent Materials Subjected to Laser Irradiation by Digital Holography

“…Hence, DH has a fast computational process that is faster than nanoindentation and 3D scanning techniques [39]. Digital holographic microscopy for cracking in transparent materials has also been successfully conducted by our team [40], showing that digital holography is suitable for crack detection in transparent materials. The fundamental principle of DH to detect crack growth is explained in Section 2.…”