Tin Whiskers Formation and Growth on Immersion Sn Surface Finish under External Stresses by Bending

Amin, Nurfatin Liyana Mohd; Yusof, Siti Zahira; Kahar, Mohamad Nawawi A. B.; Bakar, Tuty Asma Abu; Fadil, Nor Akmal

doi:10.1088/1757-899x/238/1/012001

Cited by 4 publications

(2 citation statements)

References 11 publications

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“…This is concurrent with the enactment of the EU Directive 2002/95/EC that states the use of lead (Pb) must either be eliminated or limited in a very low concentration in electrical and electronic equipment (EEE) [1][2][3][4][5][6][7][8]. The regulation to limit the use of lead in solder has brought back the Sn whiskers phenomenon and triggered numerous system failures [1,3,[8][9][10][11][12][13]. Furthermore, the trends of electronics miniaturization in microelectronics packages have resulted in a serious reliability issue of lead-free solder in electronic devices [6,8,14,15].…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

et al. 2021

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The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.

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Section: Introductionmentioning

confidence: 99%

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

et al. 2021

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“…Several theories are proposed to explain the daunting whisker nucleation and growth for several metallic systems [ 1 , 2 , 3 ], with a majority following the explanation of stress-induced growth [ 3 , 17 , 18 ]. The stress-induced theory is supported by many researchers that have proven that stress originating from material deposition [ 19 , 20 ], the formation of intermetallic phases [ 21 , 22 , 23 ], oxidation [ 24 , 25 , 26 ] or externally applied stress [ 27 , 28 , 29 , 30 ] causes whisker growth. However, whisker formation is not homogeneous nor simultaneous.…”

Section: Introductionmentioning

confidence: 99%

Revealing the Pb Whisker Growth Mechanism from Al-Alloy Surface and Morphological Dependency on Material Stress and Growth Environment

et al. 2022

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Spontaneous metallic Pb whisker formation from Pb and Bi containing Al-alloy’s surfaces is a newly discovered phenomenon. The whiskers display unique formations, growth and morphology, which give the opportunity to be applied for specialized sensor and electronics applications. Within this work, the impact of environmental conditions (gas composition and moisture) is investigated and correlated with the modification of whisker evolution and growth dynamics. Furthermore, the residual stress state of the aluminum matrix using deep cryogenic treatment is modified and used to further increase whisker nucleation and growth by up to three- and seven-fold, respectively, supported by quantitative results. The results of this paper indicate the possibility to manipulate the whisker not only in terms of their kinetics but also their morphology (optimal conditions are 20% O2 and 35% humidity). Such features allow the tailoring of the whisker structure and surface to volume ratio, which can be optimized for different applications. Finally, this research provides new insight into the growth dynamics of the whiskers through in situ and ex situ measurements, providing further evidence of the complex nucleation and growth mechanisms that dictate the spontaneous growth of Pb whiskers from Al-alloy 6026 surfaces with growth velocities up to 1.15 µm/s.

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A Multiphysics Coupled Electro-thermo-mechanical Model of Whisker Shorting

Jackson

Crandall

2018

2018 IEEE Holm Conference on Electrical Contacts

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Tin Whiskers Formation and Growth on Immersion Sn Surface Finish under External Stresses by Bending

Cited by 4 publications

References 11 publications

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Revealing the Pb Whisker Growth Mechanism from Al-Alloy Surface and Morphological Dependency on Material Stress and Growth Environment

A Multiphysics Coupled Electro-thermo-mechanical Model of Whisker Shorting

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