“…In particular, metal oxide-based materials such as AlO x , NiO x , TiO x and HfO x are currently extensively discussed because of the simplicity of the material [10,12,13,14]. Among these materials, AlO x has been widely applied in gate insulator layers [15,16,17,18] and has attracted extensive attention in the RRAM field owing to its wide band gap (~8.9 eV), high thermal stability with Si and Pt, high dielectric constant (~8) and large breakdown electric field [10,14,19,20,21,22] as Kim et al has reported [19,20,23,24,25,26]. In addition, the superior elasticity [27] and high toughness [28] make it possible for AlO x to be applied under various conditions including vibration and pressure environments [29,30,31].…”