1999
DOI: 10.1016/s1359-6454(99)00117-2
|View full text |Cite
|
Sign up to set email alerts
|

Tin-induced dynamic embrittlement of Cu–7% Sn bicrystals with a Σ5 boundary

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
40
0

Year Published

2001
2001
2016
2016

Publication Types

Select...
5
2

Relationship

2
5

Authors

Journals

citations
Cited by 30 publications
(40 citation statements)
references
References 25 publications
0
40
0
Order By: Relevance
“…Figure 1 illustrates schematically this kind of time-dependent damage mechanism. Dynamic embrittlement was shown to cause intergranular failure for several alloys and different embrittling species in earlier studies, e.g., sulfur-induced cracking of alloy steels 13 , tin-induced cracking of Cu-Sn alloys 14 and oxygen-induced cracking of a Cu-Be alloy 15 , of a Ni-Mo-Cr alloy 16 , and of the intermetallic alloy Ni 3 Al…”
Section: Dynamic Embrittlementmentioning
confidence: 94%
“…Figure 1 illustrates schematically this kind of time-dependent damage mechanism. Dynamic embrittlement was shown to cause intergranular failure for several alloys and different embrittling species in earlier studies, e.g., sulfur-induced cracking of alloy steels 13 , tin-induced cracking of Cu-Sn alloys 14 and oxygen-induced cracking of a Cu-Be alloy 15 , of a Ni-Mo-Cr alloy 16 , and of the intermetallic alloy Ni 3 Al…”
Section: Dynamic Embrittlementmentioning
confidence: 94%
“…The interpretation of these crack surfaces is as follows: At the higher oxygen pressures the crack remained sharp and propagated in rapid jumps. Whereas in a Cu-Sn bicrystal the crack growth was continuous [17], it has been found to be discontinuous in all the cases of polycrystals studied so far [9,10,13,14]. This occurs because the rate of crack advance depends on the rate of diffusion of the embrittling element into the grain boundary ahead of the crack.…”
Section: Cracking Under Fixed Displacementmentioning
confidence: 98%
“…It was found that cracking can occur in the alloy 7 18 at stress intensities below 10MPadm. The Cu-Sn bicrystals [17] cracked at stress intensities below 3Mpadm. Secondly, the temperature dependence of the cracking was closer to that of self-diffusion in nickel than to oxygen diffusion in nickel grain boundaries [14].…”
Section: Cracking Under Fixed Displacementmentioning
confidence: 99%
See 2 more Smart Citations