2005
DOI: 10.1143/jjap.44.7998
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Time-Resolving Image Analysis of Drilling of Thin Silicon Substrates with Femtosecond Laser Ablation

Abstract: We have analyzed a drilling process with a femtosecond laser on a silicon surface in order to investigate the degree of the thermal effect during the dicing of a very thin silicon substrate (thickness: 50 µm). A femtosecond laser pulse (E=30–500 µJ/pulse, τ=200 fs, λ=780 nm, f=10 Hz) was focused on a thin silicon substrate using a lens with a focal length of 100 mm. An image-intensified charge-coupled device (CCD) camera with a high-speed gate of 200 ps was utilized to take images of a drilled hole during the… Show more

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Cited by 13 publications
(6 citation statements)
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“…1) Currently, lasers and water jets are used to cut circles in brittle materials such as ceramics. [2][3][4][5][6][7] However, a disadvantage of these methods is that the conventional equipment is large and complex.…”
Section: Introductionmentioning
confidence: 99%
“…1) Currently, lasers and water jets are used to cut circles in brittle materials such as ceramics. [2][3][4][5][6][7] However, a disadvantage of these methods is that the conventional equipment is large and complex.…”
Section: Introductionmentioning
confidence: 99%
“…1) Currently, wire electric discharge or lasers are used for the hole machining of ceramics. [2][3][4][5][6][7] In addition, the combined use of ultrasonic vibration and polishing slurry has been shown to be an effective method of machining holes in brittle materials such as glass. However, conventional ultrasonic methods use only longitudinal vibration.…”
Section: Introductionmentioning
confidence: 99%
“…1) Currently, ultrasonic machining, wire electric discharge, or lasers are used for hole machining of brittle material such as ceramics. [2][3][4][5][6][7] The advantages of wire electric discharge or lasers compared with ultrasonic machining include a higher removal rate and machining accuracy. However, the disadvantages are that conventional equipment is large and its structure is intricate.…”
Section: Introductionmentioning
confidence: 99%