Time-Efficient Curing of Printed Dielectrics via Infra-Red Suitable to S2S and R2R Manufacturing Platforms for Electronic Devices

Inkjet Printing of Bioresorbable Materials for Manufacturing Transient Microelectronic Devices

“…[1][2][3][4][5][6][7] Due to the numerous benefits such as deposition accuracy in micrometer scale, industry relevant up-scalability, and efficient technique of digital processing, the inkjet printing technology is widely recognized as a smart digital fabrication tool for developing microelectronics on various polymeric substrates. [8][9][10][11] Several kinds of flexible electronics have already been manufactured using the inkjet printing technology, e.g., capacitors, thin-film transistors (TFTs), resistors, sensors and detectors, radio frequency antennas, photovoltaics, and so on. [4,5,7,[9][10][11][12][13][14][15][16] All these printed applications are clear evidences to validate the implementation of inkjet technology to deposit fundamental layers with electronic properties, i.e., conductors using nanoparticle or particle-free-based metallic or polymeric inks, dielectrics by polymerbased or hybrid inks with embedded nanoparticles and organic semiconductors (SCs).…”

“…[8][9][10][11] Several kinds of flexible electronics have already been manufactured using the inkjet printing technology, e.g., capacitors, thin-film transistors (TFTs), resistors, sensors and detectors, radio frequency antennas, photovoltaics, and so on. [4,5,7,[9][10][11][12][13][14][15][16] All these printed applications are clear evidences to validate the implementation of inkjet technology to deposit fundamental layers with electronic properties, i.e., conductors using nanoparticle or particle-free-based metallic or polymeric inks, dielectrics by polymerbased or hybrid inks with embedded nanoparticles and organic semiconductors (SCs). [11,12,17,18] Although, the printing of these novel materials has always been a big challenge, but due to the continuously evolving market scenario, it has recently become possible to deposit and postprocess (curing/sintering) these materials with high reliability, thereby, satisfying the electrical demands of devices and circuits, e.g., passive device circuit, filter circuit, and photodetectors.…”